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NLVVHC1GT125DF2

Onsemi

NLVVHC1GT125DF2 by Onsemi

NLVVHC1GT125DF2 by Onsemi is a 3-State Buffer IC with 8mA output current, operating at -55 °C to 125°C. Ideal for automotive applications, it supports voltage supply of 3V to 5.5V in a compact SC-88A package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

NLVVHC1GT125DF2 by Onsemi
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Vyrian

USA . 6,504 parts In-Stock

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Digiode

USA . 704 parts In-Stock

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704

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AZTECH Wire

Italy . 642 parts In-Stock

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$19.440

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642

$19.440

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TANS Electronics

Latvia . 5,838 parts In-Stock

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SupplyDigital Components

Austria . 5,277 parts In-Stock

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5,277

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Problanco Electronics

Mexico . 3,902 parts In-Stock

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3,902

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Kulean Microsystems

USA . 691 parts In-Stock

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Vigor

Singapore . 402 parts In-Stock

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402

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Microchip USA

USA . 349 parts In-Stock

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349

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Corphita

USA . 238 parts In-Stock

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238

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Corohmni

South Africa . 184 parts In-Stock

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UHIMA Technologies

Türkiye . 5 parts In-Stock

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Overview

Unlock the potential of your electronic designs with the NLVVHC1GT125DF2 by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch quality and reliability in all their products. This integrated circuit offers unmatched performance and versatility as a buffer, non-inverting logic type with 3-state output. With a wide operating voltage range of 3V to 5.5V and an automotive grade qualification, this component is perfect for a variety of applications. Trust Onsemi to deliver superior solutions for your electronic needs.

Feature Benefit Bullets

Standard Package: 3,000

This product is available in a standard package of 3,000 units, making it convenient for bulk orders or larger projects.

Category: Integrated Circuits (ICs), Logic Buffers, Drivers, Receivers, Transceivers

Being a part of the logic category, this product is designed specifically for signal processing and logic operations, ensuring reliable performance.

Package: Tape & Reel (TR)

The tape and reel packaging makes it easy to handle, store, and load onto automated assembly machines, saving time and effort.

Logic Type: Buffer, Non-Inverting

The non-inverting buffer design ensures that the output signal follows the input signal without phase inversion, which is often desired in digital logic circuits.

Output Type: 3-State

The 3-state output feature allows the output to be in one of three states: high, low, and high-impedance, offering versatility in controlling signal flow.

Current - Output High, Low: 8mA, 8mA

With a high and low output current capability of 8mA, this product can drive higher loads while maintaining signal integrity and performance.

Voltage - Supply: 3V ~ 5.5V

The wide supply voltage range of 3V to 5.5V ensures compatibility with various power sources, making it suitable for diverse applications.

Operating Temperature: -55 °C ~ 125°C (TA)

The wide operating temperature range of -55 °C to 125°C allows this product to withstand extreme environmental conditions, making it ideal for automotive applications.

Grade: Automotive, Qualification: AEC-Q100

The automotive-grade qualification (AEC-Q100) ensures that this product meets the stringent reliability and quality standards required for automotive applications, providing long-lasting performance.

Mounting Type: Surface Mount

The surface mount installation method simplifies PCB assembly and offers space-saving benefits, making it suitable for compact electronic designs.

Package / Case: 5-TSSOP, SC-70-5, SOT-353

The small form factor of the 5-TSSOP, SC-70-5, SOT-353 package allows for efficient use of PCB real estate, enabling compact and high-density designs.

Supplier Device Package: SC-88A (SC-70-5/SOT-353), Base Product Number: 74VHC1GT125

The SC-88A supplier device package and base product number 74VHC1GT125 provide compatibility information for sourcing and design purposes, ensuring seamless integration into projects.

Moisture Sensitivity Level (MSL): 3 (168 Hours)

The MSL rating of 3 (168 Hours) indicates the moisture sensitivity level and the duration for safe exposure to moisture, enhancing the reliability and longevity of the product.

Technical Specifications

Additional Parts NLVVHC1GT125DF2 attributes and parameters. Explore more Additional Parts devices from Onsemi

Technical Specifications

Operating Temperature:

-55°C ~ 125°C (TA)

Category:

Integrated Circuits (ICs)
Logic Buffers, Drivers, Receivers, Transceivers

Number of Bits per Element:

1

Output Type:

3-State

Logic Type:

Buffer, Non-Inverting

Grade:

Automotive

Mounting Type:

Surface Mount

Supplier Device Package:

SC-88A (SC-70-5/SOT-353)

Standard Package:

3,000

Qualification:

AEC-Q100

Package / Case:

5-TSSOP, SC-70-5, SOT-353

Voltage - Supply:

3V ~ 5.5V

Number of Elements:

1

Package:

Tape & Reel (TR)

Current - Output High, Low:

8mA, 8mA

Base Product Number:

74VHC1GT125

Moisture Sensitivity Level (MSL):

3 (168 Hours)

Trade Compliance

NLVVHC1GT125DF2 Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8542.39.0001

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Authentic purchasing experiences

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