Loading...

NLV17SG125DFT2G

Onsemi

NLV17SG125DFT2G by Onsemi

NLV17SG125DFT2G by Onsemi is a 3V bus driver with 4.8ns propagation delay, suitable for military applications. It features 5 terminals, 30pF load capacitance, and operates at -55 to 125 °C temperature range. The device has a small outline package with Gull Wing terminals and is AEC-Q100 qualified for automotive use.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,671 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,671

-

-

-

-

Digiode

USA . 828 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

828

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

TANS Electronics

Latvia . 7,519 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,519

-

-

-

-

SupplyDigital Components

Austria . 3,478 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,478

-

-

-

-

Problanco Electronics

Mexico . 3,435 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,435

-

-

-

-

Kulean Microsystems

USA . 1,894 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,894

-

-

-

-

Corphita

USA . 299 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

299

-

-

-

-

UHIMA Technologies

Türkiye . 147 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

147

-

-

-

-

Corohmni

South Africa . 140 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

140

-

-

-

-

Overview

Discover the superior performance and reliability of the NLV17SG125DFT2G by Onsemi, a top-tier manufacturer known for its cutting-edge technology and high-quality components. As a part of the Bus Driver & Transceivers category, this product offers unparalleled value and benefits across various applications. With a nominal supply voltage of 3V and a propagation delay of just 4.8ns, this device ensures fast and efficient operation. Whether you're in the automotive, industrial, or consumer electronics sector, the NLV17SG125DFT2G is the perfect choice for your next project. Unlock new possibilities and elevate your designs with this innovative solution from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the bus driver & transceiver, making it suitable for rugged environments.

Propagation Delay At Nominal Supply: 4.8 ns

Low propagation delay ensures fast signal transmission, making the product efficient for high-speed data communication.

Surface Mount: YES

Surface mount feature allows for easy installation and space-saving on PCBs, making it convenient for compact designs.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high reliability and quality standards for automotive applications, making it a reliable choice for vehicle systems.

Nominal Supply Voltage / Vsup (V): 3

Nominal supply voltage of 3V is a common standard in electronic systems, making it compatible with various power sources.

Load Capacitance (CL): 30 pF

Optimal load capacitance allows for efficient signal transmission and reception, enhancing the overall performance of the product.

No. of Terminals: 5

Having 5 terminals provides flexibility in connecting to other components or systems, making it versatile for different applications.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Small outline, thin profile, and shrink pitch package style saves space on the PCB, allowing for compact designs in electronic devices.

Maximum I (ol): 8 Amp

High maximum output current capability of 8A ensures compatibility with a wide range of devices, making it suitable for different load requirements.

Propagation Delay (tpd): 19.6 ns

Low propagation delay of 19.6 ns ensures quick response time for signal transmission, enhancing the overall speed and efficiency of the product.

Maximum Operating Temperature: 125 °C

Wide operating temperature range of up to 125 °C allows for use in harsh environmental conditions, making it suitable for automotive and industrial applications.

Output Characteristics: 3-STATE

3-state output characteristics provide flexibility in controlling the output signal, allowing for multiple signal states and reducing interference in the circuit.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature of -55 °C ensures reliable performance in cold environments, making it suitable for a wide range of operating conditions.

No. of Ports: 2

Having 2 ports allows for connectivity to multiple devices or systems, increasing the product's versatility and usability in different applications.

Maximum Seated Height: 1.1 mm

Low maximum seated height of 1.1 mm saves space on the PCB and allows for compact designs in electronic devices.

Width: 1.25 mm

Narrow width of 1.25 mm saves space on the PCB, making it suitable for compact and space-constrained designs.

Output Polarity: TRUE

True output polarity ensures correct signal transmission without inversion, enhancing the reliability and accuracy of the product.

Minimum Supply Voltage (Vsup): 0.9 V

Low minimum supply voltage of 0.9V allows for operation in low-power scenarios, making it energy-efficient and suitable for battery-powered applications.

Length: 2 mm

Compact length of 2 mm saves space on the PCB, allowing for small form factor designs in electronic devices.

Temperature Grade: MILITARY

Military-grade temperature rating ensures high reliability and durability in extreme temperature conditions, making it suitable for military and aerospace applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in noisy environments.

Terminal Form: GULL WING

Gull wing terminal form provides easy surface mount soldering and secure connections, enhancing the reliability and durability of the product.

Packing Method: TR

TR packing method ensures safe transportation and handling of the product, reducing the risk of damage during shipping and storage.

Terminal Pitch: 0.65 mm

Narrow terminal pitch of 0.65 mm allows for compact layout and efficient PCB routing, making it suitable for space-constrained designs.

Count Direction: UNIDIRECTIONAL

Unidirectional count direction ensures one-way signal transmission, reducing the risk of signal interference and improving overall system performance.

Control Type: ENABLE LOW

Enable low control type offers easy signal activation and deactivation, providing simple and efficient control over the product's output signals.

Maximum Supply Voltage (Vsup): 3.6 V

Maximum supply voltage of 3.6V allows for operation with a wide range of power sources, increasing compatibility and usability in different electronic systems.

Maximum Power Supply Current (ICC): 20 mA

Maximum power supply current of 20mA ensures efficient power consumption and reliable performance, making it suitable for low-power applications.

Technical Specifications

Bus Driver & Transceivers NLV17SG125DFT2G attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

17SG

JESD-30 Code:

R-PDSO-G5

Length:

2 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

8 Amp

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Power Supply Current (ICC):

20 mA

Propagation Delay At Nominal Supply:

4.8 ns

Propagation Delay (tpd):

19.6 ns

Screening Level:

AEC-Q100

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

.9 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Width:

1.25 mm

Trade Compliance

NLV17SG125DFT2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 4