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NLV14029BDR2G

Onsemi

NLV14029BDR2G by Onsemi

NLV14029BDR2G by Onsemi is a 4-bit digital counter with 400ns propagation delay. Operating at -55 to 125°C, it has a max frequency of 2MHz and supports bidirectional counting. Ideal for military applications requiring synchronous operation in small outline packages.

Median Price

$0.382

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

$0.340

1k+ parts

$0.282

10k+ parts

$0.251

10,000

-

$0.340

$0.282

$0.251

DigiKey

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.420

10k+ parts

-

10,000

-

-

$0.420

-

Verical

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.382

10k+ parts

$0.314

10,000

-

-

$0.382

$0.314

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 839 parts In-Stock

1+ parts

$0.264

100+ parts

-

1k+ parts

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10k+ parts

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839

$0.264

-

-

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Vyrian

USA . 1,127 parts In-Stock

1+ parts

$0.278

100+ parts

-

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1,127

$0.278

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ComSIT Distribution GmbH

Germany . 1,960 parts In-Stock

1+ parts

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1,960

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Distributors (Availability)

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Corphita

USA . 1,240 parts In-Stock

1+ parts

$0.250

100+ parts

-

1k+ parts

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10k+ parts

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1,240

$0.250

-

-

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Corohmni

South Africa . 464 parts In-Stock

1+ parts

$0.278

100+ parts

-

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464

$0.278

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-

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Vigor

Singapore . 333 parts In-Stock

1+ parts

$0.310

100+ parts

-

1k+ parts

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333

$0.310

-

-

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Kulean Microsystems

USA . 4,946 parts In-Stock

1+ parts

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4,946

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Problanco Electronics

Mexico . 3,958 parts In-Stock

1+ parts

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3,958

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SupplyDigital Components

Austria . 3,869 parts In-Stock

1+ parts

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3,869

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TANS Electronics

Latvia . 2,549 parts In-Stock

1+ parts

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2,549

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iodParts Technologies Inc.

India . 1,960 parts In-Stock

1+ parts

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100+ parts

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1,960

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UHIMA Technologies

Türkiye . 10 parts In-Stock

1+ parts

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100+ parts

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10

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Overview

Unlock the possibilities with the Onsemi NLV14029BDR2G digital counter, a top-tier product from a trusted manufacturer known for delivering high-quality components. Ideal for a wide range of applications, this digital counter offers unparalleled value with its reliability and efficiency. With a focus on customer satisfaction, Onsemi ensures that this product provides numerous benefits and advantages to meet your specific needs. Upgrade your projects with the NLV14029BDR2G and experience superior performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package durable and lightweight, suitable for various applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on circuit boards.

Screening Level: AEC-Q100

The AEC-Q100 screening level ensures high reliability and quality, making it suitable for automotive applications.

No. of Bits: 4

Having 4 bits allows for counting up to 15, making it suitable for digital counting applications.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard supply voltage of 5V, making it compatible with most electronic systems.

Propagation Delay (tpd): 400 ns

With a low propagation delay, the counter provides quick and accurate counting results.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for various operating environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency of the digital counter.

Technical Specifications

Digital Counters NLV14029BDR2G attributes and parameters. Explore more Digital Counters devices from Onsemi

Specs

Count Direction:

BIDIRECTIONAL

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

2000000 Hz

Operation Mode:

SYNCHRONOUS

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay (tpd):

400 ns

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Sub-Category:

Counters

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

3.9 mm

Trade Compliance

NLV14029BDR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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