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NLSF595DR2

Onsemi

NLSF595DR2 by Onsemi

NLSF595DR2 by Onsemi is a graphics display driver with 16 terminals, operating voltage range of 2-5V, and max supply voltage of 5.5V. It features serial data input mode and CMOS technology, suitable for LED display driver applications in military-grade environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 550 parts In-Stock

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550

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Vyrian

USA . 544 parts In-Stock

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544

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Distributors (Availability)

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Problanco Electronics

Mexico . 5,596 parts In-Stock

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5,596

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SupplyDigital Components

Austria . 3,656 parts In-Stock

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TANS Electronics

Latvia . 3,654 parts In-Stock

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Kulean Microsystems

USA . 3,073 parts In-Stock

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3,073

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Corphita

USA . 1,675 parts In-Stock

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Corohmni

South Africa . 276 parts In-Stock

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276

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UHIMA Technologies

Türkiye . 121 parts In-Stock

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Overview

Elevate your display experience with the NLSF595DR2 by Onsemi, a top-tier manufacturer known for its cutting-edge technology and superior quality products. As a leader in Graphics Display Drivers, this product offers unmatched value and benefits to customers looking for high-performance solutions. With its sleek design and versatile applications, this LED display driver is perfect for various industries and projects. Experience the difference with Onsemi's NLSF595DR2 and take your displays to the next level of excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and long-lasting.

Data Input Mode: SERIAL

Serial data input allows for efficient communication and data transfer between devices.

Surface Mount: YES

Surface mount technology makes installation easier and more reliable compared to through-hole mounting.

Maximum Supply Voltage: 5.5 V

Supports a wide range of supply voltages, providing flexibility in different operating conditions.

Package Shape: RECTANGULAR

Rectangular shape offers a compact design that is space-efficient and easier to integrate into circuit layouts.

Power Supplies (V): 2/5

Supports multiple power supply options, allowing for compatibility with various systems.

No. of Terminals: 16

Sufficient number of terminals for connectivity options and functionality.

Minimum Supply Voltage: 2 V

Low minimum supply voltage enables energy efficiency and compatibility with low-power systems.

Maximum Operating Temperature: 125 °C

High operating temperature range ensures reliable performance in various environments.

Minimum Operating Temperature: -55 °C

Wide temperature range allows for operation even in extreme cold conditions.

Terminal Finish: TIN LEAD

Tin lead finish provides good solderability and conductivity for stable connections.

Terminal Position: DUAL

Dual terminal position offers flexibility in installation and PCB layout.

Maximum Seated Height: 1.75 mm

Low profile design for space-saving and easy integration in compact applications.

Width: 3.9 mm

Compact width for efficient use of PCB space.

Length: 9.9 mm

Optimal length for fitting into various device dimensions.

Temperature Grade: MILITARY

Military-grade temperature range for reliable operation in harsh environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminal form for easy surface mounting and secure connections.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage for consistent performance.

No. of Segments: 8

Suitable number of segments for driving LED displays efficiently.

Terminal Pitch: 1.27 mm

Standard terminal pitch for compatibility with common PCB layouts.

Minimum fmax: 135 MHz

High maximum frequency for fast data processing and display refresh rates.

Interface IC Type: LED DISPLAY DRIVER

Specifically designed for driving LED displays with optimal performance and efficiency.

Technical Specifications

Graphics Display Drivers NLSF595DR2 attributes and parameters. Explore more Graphics Display Drivers devices from Onsemi

Specs

Data Input Mode:

SERIAL

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

Length:

9.9 mm

Multiplexed Display Capability:

NO

No. of Functions:

1

No. of Segments:

8

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

2/5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Display Drivers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Minimum fmax:

135 MHz

Trade Compliance

NLSF595DR2 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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