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NCV8774DT50RKG

Onsemi

NCV8774DT50RKG by Onsemi

NCV8774DT50RKG by Onsemi is a Fixed Positive Single Output LDO Regulator with a nominal output voltage of 5V and max output current of 0.35A. It operates in an extended temperature range from -40 to 150 °C, making it suitable for automotive applications requiring stable voltage regulation in harsh environments.

Median Price

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Lifecycle Status

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6

In-Stock Inventory

1k+

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Avnet

USA . 12,500 parts In-Stock

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Chip Stock

USA . 23,500 parts In-Stock

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Flip Electronics

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Cyclops Electronics Ltd

UK . 10,000 parts In-Stock

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Vyrian

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Digiode

USA . 1,474 parts In-Stock

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Vigor

Singapore . 225 parts In-Stock

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$3.100

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AZTECH Wire

Italy . 196 parts In-Stock

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Infinite Electronics LLP (Excess)

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SupplyDigital Components

Austria . 8,073 parts In-Stock

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Futuretech Components

Singapore . 7,500 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,834 parts In-Stock

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TANS Electronics

Latvia . 5,465 parts In-Stock

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Perfect Parts

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iodParts Technologies Inc.

India . 5,000 parts In-Stock

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Kulean Microsystems

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Problanco Electronics

Mexico . 3,491 parts In-Stock

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Microchip USA

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Corphita

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UHIMA Technologies

Türkiye . 463 parts In-Stock

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Corohmni

South Africa . 199 parts In-Stock

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Overview

Discover the NCV8774DT50RKG by Onsemi, a high-quality Fixed Regulator with a range of applications. Onsemi's reputation for excellence ensures that this product delivers reliable performance and efficiency. Ideal for various electronic devices, this regulator provides customers with superior voltage control, stability, and protection. Don't compromise on quality - choose the NCV8774DT50RKG for unparalleled value and peace of mind in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and resistant to damage.

Maximum Dropout Voltage: 1.875 V

Low dropout voltage ensures efficient power conversion and minimal energy loss.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation on PCBs.

Operating Temperature (TJ-Max): 150 °C

Wide operating temperature range ensures stability and reliability in various environmental conditions.

Screening Level: AEC-Q100

Meets automotive standards, indicating high quality and suitability for automotive applications.

Technology: CMOS

CMOS technology offers low power consumption and high efficiency, making the product energy-efficient.

Package Shape: RECTANGULAR

Rectangular shape allows for compact and space-saving design, ideal for constrained layouts.

Terminal Form: GULL WING

Gull wing terminals provide secure and reliable connections, ensuring stable performance.

Operating Temperature (TJ-Min): -40 °C

Wide temperature range allows for operation in extreme cold environments without compromising performance.

Packing Method: TR

TR packing method ensures easy handling and protection during transportation and storage.

Minimum Output Voltage: 4.9 V

Stable minimum output voltage ensures consistent power supply to connected devices.

Maximum Voltage Tolerance: 2 %

Low voltage tolerance ensures accurate and reliable output voltage regulation.

Nominal Output Voltage: 5 V

Stable nominal output voltage meets standard voltage requirements for various electronic applications.

No. of Terminals: 2

Simple two-terminal design simplifies installation and reduces complexity.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG

Small outline package with heat sink ensures efficient heat dissipation for reliable operation.

Adjustability: FIXED

Fixed output voltage eliminates the need for adjustment, simplifying the setup process.

Terminal Pitch: 2.29 mm

Optimal terminal pitch allows for easy integration into standard PCB layouts.

Regulator Type: FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

LDO regulator provides stable output voltage with low noise, essential for sensitive electronic components.

Terminal Finish: Tin (Sn)

Tin terminal finish ensures reliable soldering connections for long-term performance.

Terminal Position: SINGLE

Single terminal position simplifies installation and reduces the risk of connection errors.

Maximum Output Voltage: 5.1 V

High maximum output voltage ensures compatibility with various devices requiring slightly higher voltage levels.

Maximum Seated Height: 2.51 mm

Low seated height allows for compact design and easy integration into small electronic devices.

Width: 6.095 mm

Narrow width allows for space-saving installation in tight layouts.

Maximum Load Regulation: 0.035 %

Low load regulation ensures stable and accurate output voltage regardless of the load variations.

Minimum Input Voltage: 4.5 V

Low minimum input voltage allows for efficient operation with a wide range of power sources.

Maximum Output Current: 0.35 A

Suitable output current rating ensures compatibility with various devices requiring moderate power levels.

Maximum Time At Peak Reflow Temperature (s): 30

Resilient design allows for reliable performance during peak reflow processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures durability during manufacturing processes.

Nominal Dropout Voltage: 0.44 V

Low dropout voltage ensures efficient power conversion and minimal heat dissipation.

Length: 6.54 mm

Compact length allows for easy integration into various electronic designs.

Maximum Input Voltage: 40 V

High maximum input voltage rating provides flexibility for use with various power sources.

Maximum Input Voltage Absolute: 40 V

Absolute maximum input voltage rating ensures protection against voltage spikes and surges.

Technical Specifications

Fixed Regulators - Positive Single Output LDO NCV8774DT50RKG attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Onsemi

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.875 V

Nominal Dropout Voltage-1:

.44 V

Maximum Input Voltage Absolute:

Maximum Input Voltage:

40 V

Minimum Input Voltage:

4.5 V

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Length:

6.54 mm

Maximum Load Regulation:

.035 %

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

2

Operating Temperature (TJ-Max):

150 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.35 A

Maximum Output Voltage-1:

5.1 V

Minimum Output Voltage-1:

4.9 V

Nominal Output Voltage-1:

5 V

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

SMSIP3H,.38,90TB

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG

Packing Method:

TR

Peak Reflow Temperature (C):

260

Qualification Status:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

2.51 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

2.29 mm

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Voltage Tolerance:

2 %

Width:

6.095 mm

Trade Compliance

NCV8774DT50RKG Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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