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NCV8720BMT150TBG

Onsemi

NCV8720BMT150TBG by Onsemi

NCV8720BMT150TBG by Onsemi is a Fixed Positive Single Output LDO Regulator with a max output current of 0.35A and an operating temperature range from -40 to 125 °C. This CMOS technology regulator has a small outline package style, making it suitable for automotive applications requiring precise voltage regulation in compact spaces.

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Vyrian

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Digiode

USA . 1,819 parts In-Stock

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AZTECH Wire

Italy . 558 parts In-Stock

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$18.500

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Component Stockers USA

USA . 555 parts In-Stock

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$99.990

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Kulean Microsystems

USA . 4,492 parts In-Stock

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TANS Electronics

Latvia . 3,704 parts In-Stock

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Corphita

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Problanco Electronics

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SupplyDigital Components

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UHIMA Technologies

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Microchip USA

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Overview

Power up your projects with the NCV8720BMT150TBG by Onsemi, a top-of-the-line Fixed Regulator that delivers reliable performance and precise output voltage. Manufactured by Onsemi, a leader in semiconductor solutions, this LDO regulator offers superior quality, durability, and efficiency. Perfect for a wide range of applications, this product ensures stable power supply and optimal performance. Say goodbye to voltage fluctuations and hello to seamless operation with the NCV8720BMT150TBG. Experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the regulator, making it suitable for various environmental conditions.

Maximum Dropout Voltage: 1.2 V

Low dropout voltage ensures efficient regulation of output voltage even when the input voltage is close to the output voltage.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and effort during manufacturing.

Operating Temperature (TJ-Max): 125 °C

Wide operating temperature range allows for reliable performance in extreme conditions.

Screening Level: AEC-Q100

AEC-Q100 certification ensures high reliability and quality standards suitable for automotive applications.

Technology: CMOS

CMOS technology offers low power consumption and high efficiency for better energy efficiency.

Package Shape: SQUARE

Square package shape allows for efficient use of board space and easy integration into designs.

Operating Temperature (TJ-Min): -40 °C

Wide operating temperature range ensures functionality in low temperature environments.

Minimum Output Voltage: 1.47 V

Provides a stable and accurate output voltage within a close tolerance range.

Maximum Voltage Tolerance: 2 %

Offers precise voltage regulation for consistent performance of connected components.

Nominal Output Voltage: 1.5 V

Standard output voltage suitable for a wide range of applications.

No. of Terminals: 6

Sufficient terminals for easy connectivity and integration into circuits.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Compact package style with heat sink features for efficient heat dissipation and space-saving design.

Adjustability: FIXED

Fixed output voltage eliminates the need for manual adjustments, providing consistent performance.

Terminal Pitch: 0.65 mm

Close terminal pitch allows for compact design and efficient PCB layout.

Regulator Type: FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

LDO regulator ensures stable output voltage with minimal voltage drop, suitable for sensitive electronic components.

Terminal Finish: Matte Tin (Sn)

Matte tin finish provides corrosion resistance and ensures secure electrical connections.

Terminal Position: DUAL

Dual terminal position allows for flexibility in mounting and connection options.

Maximum Output Voltage: 1.53 V

Ensures that the output voltage remains within safe limits under normal operating conditions.

Maximum Seated Height: 0.8 mm

Low profile design for space-constrained applications.

Width: 2 mm

Compact width for efficient use of board space.

Minimum Input Voltage: 2 V

Wide input voltage range for compatibility with different power sources.

Maximum Output Current: 0.35 A

Able to deliver sufficient current for powering various electronic components.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures reliable soldering during manufacturing process.

Peak Reflow Temperature °C: 260

High temperature tolerance during reflow soldering process.

Nominal Dropout Voltage: 0.11 V

Low dropout voltage ensures efficient power conversion with minimal energy loss.

Length: 2 mm

Compact length for space-saving design.

Maximum Input Voltage: 4.5 V

Wide input voltage range for versatile applications.

Maximum Input Voltage Absolute: 6 V

Can handle higher transient voltage spikes without damage.

Technical Specifications

Fixed Regulators - Positive Single Output LDO NCV8720BMT150TBG attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Onsemi

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.2 V

Nominal Dropout Voltage-1:

.11 V

Maximum Input Voltage Absolute:

6 V

Maximum Input Voltage:

4.5 V

Minimum Input Voltage:

2 V

JESD-30 Code:

S-PDSO-N6

JESD-609 Code:

e3

Length:

2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

6

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.35 A

Maximum Output Voltage-1:

1.53 V

Minimum Output Voltage-1:

1.47 V

Nominal Output Voltage-1:

1.5 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.08,25

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

.8 mm

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Voltage Tolerance:

2 %

Width:

2 mm

Trade Compliance

NCV8720BMT150TBG Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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