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NCV8668ABPD50R2G

Onsemi

NCV8668ABPD50R2G by Onsemi

Onsemi's NCV8668ABPD50R2G is a fixed positive single output LDO regulator with a nominal output voltage of 5V and max dropout voltage of 0.6V. It operates in temperatures ranging from -40 to 150 °C, making it suitable for various applications requiring stable voltage regulation in compact spaces.

Median Price

$1.710

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 75,000 parts In-Stock

1+ parts

-

100+ parts

$1.710

1k+ parts

$1.530

10k+ parts

$1.440

75,000

-

$1.710

$1.530

$1.440

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,179 parts In-Stock

1+ parts

$1.890

100+ parts

-

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2,179

$1.890

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Chip Stock

USA . 53,000 parts In-Stock

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53,000

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Vyrian

USA . 5,240 parts In-Stock

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5,240

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Distributors (Availability)

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Vigor

Singapore . 266 parts In-Stock

1+ parts

$1.250

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-

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266

$1.250

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Corphita

USA . 881 parts In-Stock

1+ parts

$1.791

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881

$1.791

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Corohmni

South Africa . 476 parts In-Stock

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$1.990

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476

$1.990

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AZTECH Wire

Italy . 759 parts In-Stock

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$18.340

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759

$18.340

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Component Stockers USA

USA . 473 parts In-Stock

1+ parts

$99.990

100+ parts

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473

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 21,223 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,585 parts In-Stock

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6,585

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Kulean Microsystems

USA . 5,496 parts In-Stock

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5,496

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Kepictronics

USA . 1,796 parts In-Stock

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1,796

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Problanco Electronics

Mexico . 1,628 parts In-Stock

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1,628

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SupplyDigital Components

Austria . 1,516 parts In-Stock

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1,516

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Microchip USA

USA . 444 parts In-Stock

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444

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UHIMA Technologies

Türkiye . 29 parts In-Stock

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29

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TANS Electronics

Latvia . 23 parts In-Stock

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23

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Overview

Elevate your projects with the NCV8668ABPD50R2G by Onsemi, a top-of-the-line Fixed Regulator that guarantees superior quality and reliable performance. Manufactured by Onsemi, a renowned leader in the industry, this LDO regulator offers unmatched precision and stability for various applications. With a compact design and high efficiency, this product ensures seamless operation and optimal power management. Experience the value of increased productivity and enhanced results with the NCV8668ABPD50R2G – the ultimate choice for professionals seeking excellence in their work.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy construction ensures durability and protects the internal components of the regulator, making it reliable for long-term use.

Maximum Dropout Voltage-1: 1.6 V

With a low dropout voltage, this regulator can provide a stable output voltage even when the input voltage fluctuates, ensuring consistent performance.

Surface Mount: YES

Being surface mountable, this regulator is easy to install on circuit boards, saving space and simplifying the manufacturing process.

Operating Temperature (TJ-Max): 150 °C

With a high maximum operating temperature, this regulator can withstand demanding environmental conditions and operate reliably in a wide range of applications.

Nominal Output Voltage-1: 5 V

The stable 5V output voltage makes this regulator suitable for a variety of electronic devices and ensures consistent performance.

Maximum Output Current-1: 0.15 A

The maximum output current of 0.15A allows this regulator to power small to medium-sized electronic components efficiently and safely.

Technical Specifications

Fixed Regulators - Positive Single Output LDO NCV8668ABPD50R2G attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Onsemi

Specs

Maximum Dropout Voltage-1:

.6 V

Maximum Input Voltage:

40 V

Minimum Input Voltage:

5.6 V

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

8

Operating Temperature (TJ-Max):

150 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.15 A

Maximum Output Voltage-1:

5.1 V

Minimum Output Voltage-1:

4.9 V

Nominal Output Voltage-1:

5 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification Status:

Not Qualified

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Voltage Tolerance:

2 %

Width:

3.9 mm

Trade Compliance

NCV8668ABPD50R2G Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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