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NCV86602BDT33RKG

Onsemi

NCV86602BDT33RKG by Onsemi

NCV86602BDT33RKG by Onsemi is a fixed positive single output LDO regulator with an output voltage of 3.3V and max current of 0.15A. It operates in temperatures ranging from -40 to 125 °C, making it suitable for various applications requiring stable voltage regulation in compact spaces.

Median Price

$1.200

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

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DigiKey

USA . 657 parts In-Stock

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Flip Electronics (Authorized)

USA . 657 parts In-Stock

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Vyrian

USA . 6,728 parts In-Stock

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R&J Components

USA . 2,500 parts In-Stock

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USA . 657 parts In-Stock

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Digiode

USA . 636 parts In-Stock

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Vigor

Singapore . 627 parts In-Stock

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$0.940

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627

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Corohmni

South Africa . 495 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 9,851 parts In-Stock

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Problanco Electronics

Mexico . 6,745 parts In-Stock

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TANS Electronics

Latvia . 6,581 parts In-Stock

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Kulean Microsystems

USA . 3,397 parts In-Stock

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Microchip USA

USA . 2,982 parts In-Stock

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SupplyDigital Components

Austria . 2,965 parts In-Stock

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GreenTree Electronics

Israel . 2,500 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Metaverse IC Inc.

Canada . 1,100 parts In-Stock

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Kepictronics

USA . 970 parts In-Stock

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Corphita

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UHIMA Technologies

Türkiye . 448 parts In-Stock

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Overview

Discover the NCV86602BDT33RKG by Onsemi, a top-quality Fixed Regulator that guarantees reliable performance in a compact design. Manufactured by Onsemi, a trusted industry leader, this LDO regulator offers precise voltage regulation with minimal output voltage variations. Ideal for various applications, this product ensures stable power supply for your electronic devices. Experience the superior quality and efficiency of Onsemi's NCV86602BDT33RKG and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation on circuit boards, saving space and reducing assembly time.

Operating Temperature (TJ-Max): 125 °C

With a high operating temperature limit of 125 °C, the regulator can withstand harsh environmental conditions and ensure stable performance.

Nominal Output Voltage-1: 3.3 V

The precise nominal output voltage of 3.3V ensures a stable and reliable power supply, suitable for sensitive electronic components.

Maximum Load Regulation: 0.02 %

The tight load regulation of 0.02% ensures consistent output voltage under varying load conditions, providing reliable power to connected devices.

Maximum Output Current-1: 0.15 A

With a maximum output current of 0.15A, the regulator can deliver sufficient power to drive low-power electronic devices efficiently.

Technical Specifications

Fixed Regulators - Positive Single Output LDO NCV86602BDT33RKG attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Onsemi

Specs

Nominal Dropout Voltage-1:

1.2 V

Maximum Input Voltage:

40 V

Minimum Input Voltage:

4.5 V

JESD-30 Code:

R-PSSO-G4

JESD-609 Code:

e3

Length:

6.54 mm

Maximum Load Regulation:

.02 %

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

4

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.15 A

Maximum Output Voltage-1:

3.366 V

Minimum Output Voltage-1:

3.234 V

Nominal Output Voltage-1:

3.3 V

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification Status:

Not Qualified

Maximum Seated Height:

2.38 mm

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.14 mm

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Voltage Tolerance:

2 %

Width:

6.095 mm

Trade Compliance

NCV86602BDT33RKG Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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