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NCV86602BD33R2G

Onsemi

NCV86602BD33R2G by Onsemi

NCV86602BD33R2G by Onsemi is a fixed positive single output LDO regulator with an output voltage of 3.3V and max current of 0.15A. It operates in temperatures ranging from -40 to 125 °C, making it suitable for various applications requiring stable voltage regulation in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,832 parts In-Stock

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R&J Components

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Digiode

USA . 1,452 parts In-Stock

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Ampacity Inc.

Singapore . 1,117 parts In-Stock

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$0.500

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AZTECH Wire

Italy . 572 parts In-Stock

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$11.930

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TANS Electronics

Latvia . 5,704 parts In-Stock

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Kulean Microsystems

USA . 2,891 parts In-Stock

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Perfect Parts

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SupplyDigital Components

Austria . 2,511 parts In-Stock

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Problanco Electronics

Mexico . 2,067 parts In-Stock

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Corphita

USA . 1,298 parts In-Stock

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Vigor

Singapore . 917 parts In-Stock

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UHIMA Technologies

Türkiye . 869 parts In-Stock

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Microchip USA

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Corohmni

South Africa . 235 parts In-Stock

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Overview

Discover the NCV86602BD33R2G by Onsemi, a top-quality Fixed Regulator that guarantees reliable performance and precision output. Manufactured by Onsemi, a renowned industry leader, this LDO regulator is perfect for a wide range of applications. With its compact design and efficient operation, this product offers customers unparalleled value and benefits. Trust Onsemi to deliver cutting-edge technology and superior products that exceed expectations. Upgrade your devices with the NCV86602BD33R2G and experience excellence like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring long-term reliability.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

Operating Temperature (TJ-Max): 125 °C

Ensures reliable performance even in high-temperature environments, making it suitable for a wide range of applications.

Minimum Output Voltage: 3.234 V

Provides a stable and precise output voltage for consistent power supply to connected devices.

Nominal Output Voltage: 3.3 V

Offers a standard output voltage that is commonly used in various electronic applications.

No. of Terminals: 8

Provides multiple connection points for easy integration into circuit designs.

Maximum Output Current: 0.15 A

Capable of delivering a sufficient amount of current to power various components within a circuit.

Nominal Dropout Voltage: 1.2 V

Allows for a small voltage drop between the input and output, ensuring efficient power conversion.

Technical Specifications

Fixed Regulators - Positive Single Output LDO NCV86602BD33R2G attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Onsemi

Specs

Nominal Dropout Voltage-1:

1.2 V

Maximum Input Voltage:

40 V

Minimum Input Voltage:

4.5 V

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Maximum Load Regulation:

.02 %

No. of Functions:

1

No. of Terminals:

8

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.15 A

Maximum Output Voltage-1:

3.366 V

Minimum Output Voltage-1:

3.234 V

Nominal Output Voltage-1:

3.3 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Qualification Status:

Not Qualified

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Voltage Tolerance:

2 %

Width:

3.9 mm

Trade Compliance

NCV86602BD33R2G Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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