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NCV86601BDT50RKG

Onsemi

NCV86601BDT50RKG by Onsemi

NCV86601BDT50RKG by Onsemi is a Fixed Positive Single Output LDO Regulator with a Nominal Output Voltage of 5V, Max Dropout Voltage of 0.6V, and Max Output Current of 0.15A. It is ideal for applications requiring stable voltage regulation in a compact package, such as consumer electronics and industrial control systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

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Flip Electronics (Authorized)

USA . 9,337 parts In-Stock

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Flip Electronics

USA . 9,337 parts In-Stock

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9,337

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Vyrian

USA . 7,836 parts In-Stock

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Digiode

USA . 864 parts In-Stock

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Vigor

Singapore . 154 parts In-Stock

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$2.090

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154

$2.090

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AZTECH Wire

Italy . 435 parts In-Stock

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$20.310

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Perfect Parts

USA . 156,800 parts In-Stock

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Kulean Microsystems

USA . 6,529 parts In-Stock

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Problanco Electronics

Mexico . 5,642 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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TANS Electronics

Latvia . 2,987 parts In-Stock

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Corphita

USA . 1,067 parts In-Stock

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SupplyDigital Components

Austria . 752 parts In-Stock

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Microchip USA

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UHIMA Technologies

Türkiye . 380 parts In-Stock

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Corohmni

South Africa . 88 parts In-Stock

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Overview

Discover the NCV86601BDT50RKG by Onsemi, a top-quality fixed regulator that offers dependable performance and reliability. Manufactured by Onsemi, a trusted leader in the industry, this LDO regulator is perfect for a wide range of applications. With its precise voltage regulation and compact design, this product ensures consistent power output for your devices. Experience the value and benefits of the NCV86601BDT50RKG, providing customers with efficient power management solutions that deliver superior performance every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the components inside the package, ensuring reliable performance.

Maximum Dropout Voltage-1: 1.6 V

Low dropout voltage ensures that the regulator can maintain a stable output voltage even when the input voltage fluctuates, making it suitable for sensitive electronic devices.

Surface Mount: YES

Surface mount design allows for easy and efficient installation on a circuit board, saving space and reducing assembly time.

Operating Temperature (TJ-Max): 125 °C

With a high operating temperature range, this regulator can withstand demanding environmental conditions without compromising performance.

Package Shape: RECTANGULAR

Rectangular shape makes it easy to integrate into various electronic devices and applications.

Terminal Form: GULL WING

Gull wing terminals provide secure connections to the circuit board, ensuring reliability and durability.

Operating Temperature (TJ-Min): -40 °C

With a low operating temperature range, this regulator can function in extreme cold environments without any issues.

Minimum Output Voltage-1: 4.9 V

Provides a stable minimum output voltage for powering sensitive components and circuits.

Maximum Voltage Tolerance: 2 %

Accurate voltage regulation within a tight tolerance range ensures consistent performance of connected devices.

Nominal Output Voltage-1: 5 V

A commonly used voltage that is suitable for a wide range of electronic applications.

No. of Terminals: 4

Having 4 terminals allows for easy installation and secure connections on the circuit board.

Package Style (Meter): SMALL OUTLINE

Compact small outline package style saves space on the circuit board, ideal for applications with limited real estate.

Terminal Pitch: 1.14 mm

The close terminal pitch enables efficient connections and reduces the overall footprint of the device.

Regulator Type: FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

Specific type of regulator that provides consistent, reliable voltage output for sensitive electronic components.

Terminal Finish: TIN

Tin terminal finish ensures good conductivity and prevents corrosion for long-term performance.

Terminal Position: SINGLE

Single terminal position allows for simple and efficient installation on the circuit board.

Maximum Output Voltage-1: 5.1 V

Provides a stable maximum output voltage for powering various electronic components.

Maximum Seated Height: 2.38 mm

Low profile design with a maximum seated height of 2.38 mm allows for easy integration into compact electronic devices.

Width: 6.095 mm

Narrow width enables space-saving installation on the circuit board, suitable for compact designs.

Minimum Input Voltage: 4.5 V

Low minimum input voltage requirement allows for operation in a wide range of power supply scenarios.

Maximum Output Current-1: 0.15 A

Able to provide a stable output current of 0.15 A, suitable for powering various electronic components and circuits.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for up to 30 seconds, ensuring reliable soldering during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability of 260 °C ensures proper soldering and robust connections on the circuit board.

Length: 6.54 mm

The compact length of 6.54 mm enables easy integration into space-constrained electronic devices.

Maximum Input Voltage: 40 V

High maximum input voltage of 40 V allows for versatile applications and compatibility with a wide range of power sources.

Technical Specifications

Fixed Regulators - Positive Single Output LDO NCV86601BDT50RKG attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Onsemi

Specs

Maximum Dropout Voltage-1:

.6 V

Maximum Input Voltage:

40 V

Minimum Input Voltage:

4.5 V

JESD-30 Code:

R-PSSO-G4

JESD-609 Code:

e3

Length:

6.54 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

4

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.15 A

Maximum Output Voltage-1:

5.1 V

Minimum Output Voltage-1:

4.9 V

Nominal Output Voltage-1:

5 V

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification Status:

Not Qualified

Maximum Seated Height:

2.38 mm

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.14 mm

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Voltage Tolerance:

2 %

Width:

6.095 mm

Trade Compliance

NCV86601BDT50RKG Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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