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NCV8614BMNR2G

Onsemi

NCV8614BMNR2G by Onsemi

NCV8614BMNR2G by Onsemi is a fixed/adjustable positive multiple output LDO regulator with 20 terminals in a small outline package. It features matte tin terminal finish and can withstand peak reflow temperature of 260 °C for up to 30 seconds. Ideal for applications requiring precise voltage regulation in compact electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 7,731 parts In-Stock

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Digiode

USA . 2,118 parts In-Stock

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Distributors (Availability)

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Advanced Electronics

New Zealand . 600 parts In-Stock

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$2.638

100+ parts

$2.401

1k+ parts

$2.163

10k+ parts

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600

$2.638

$2.401

$2.163

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AZTECH Wire

Italy . 668 parts In-Stock

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$12.920

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668

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TANS Electronics

Latvia . 6,149 parts In-Stock

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SupplyDigital Components

Austria . 5,937 parts In-Stock

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5,937

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A-Z Elektronik GmbH

Germany . 5,022 parts In-Stock

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5,022

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Problanco Electronics

Mexico . 4,529 parts In-Stock

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4,529

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Kulean Microsystems

USA . 3,929 parts In-Stock

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Corphita

USA . 2,313 parts In-Stock

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Microchip USA

USA . 253 parts In-Stock

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Corohmni

South Africa . 224 parts In-Stock

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224

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Perfect Parts

USA . 202 parts In-Stock

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UHIMA Technologies

Türkiye . 158 parts In-Stock

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158

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Overview

Discover the NCV8614BMNR2G by Onsemi, a high-quality Fixed & Adjustable Regulator that offers multiple output options for your power management needs. With Onsemi's reputation for reliable products, this LDO regulator provides exceptional performance and stability. Ideal for a wide range of applications, this product is designed to deliver value and benefits to customers seeking efficient power solutions. Say goodbye to power fluctuations and hello to seamless operation with the NCV8614BMNR2G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body provides durability and protection against external elements, making the product reliable for long-term use.

Surface Mount: YES

Being surface mount compatible allows for easy and convenient installation on circuit boards, saving space and simplifying the manufacturing process.

Package Shape: RECTANGULAR

The rectangular package shape ensures efficient use of board space and facilitates easier placement in compact electronic devices.

No. of Terminals: 20

Having 20 terminals allows for multiple connections and configurations, enabling versatile applications and customization options.

Regulator Type: FIXED/ADJUSTABLE POSITIVE MULTIPLE OUTPUT LDO REGULATOR

The multiple output options and ability to adjust the regulator settings make this product suitable for various power supply requirements with precise voltage control.

Terminal Finish: MATTE TIN

The matte tin terminal finish offers excellent conductivity and solderability, ensuring robust connections and reliable performance in diverse operating conditions.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260 °C, the product can withstand high-temperature soldering processes, making it suitable for automated assembly and reflow soldering.

Technical Specifications

Fixed & Adjustable Regulators - Positive Multiple Output LDO NCV8614BMNR2G attributes and parameters. Explore more Fixed & Adjustable Regulators - Positive Multiple Output LDO devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-N20

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

20

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification Status:

Not Qualified

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NCV8614BMNR2G Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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