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NCV8502D100R2

Onsemi

NCV8502D100R2 by Onsemi

Onsemi's NCV8502D100R2 is a fixed positive single output LDO regulator with 10V nominal output voltage, 0.6V max dropout voltage, and 0.15A max output current. It is ideal for automotive applications due to AEC-Q100 screening level and operating temperature range of -40 °C to 150°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,848 parts In-Stock

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Digiode

USA . 1,024 parts In-Stock

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AZTECH Wire

Italy . 1,146 parts In-Stock

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$15.350

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QUARKTWIN TECHNOLOGY LTD

USA . 26,995 parts In-Stock

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SupplyDigital Components

Austria . 5,019 parts In-Stock

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Problanco Electronics

Mexico . 4,500 parts In-Stock

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TANS Electronics

Latvia . 2,300 parts In-Stock

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Kulean Microsystems

USA . 1,945 parts In-Stock

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Vigor

Singapore . 683 parts In-Stock

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Corphita

USA . 664 parts In-Stock

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Microchip USA

USA . 463 parts In-Stock

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Corohmni

South Africa . 379 parts In-Stock

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UHIMA Technologies

Türkiye . 325 parts In-Stock

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Overview

Discover the NCV8502D100R2 by Onsemi, a premium Fixed Regulator that offers unmatched quality and reliability. Manufactured by Onsemi, a leader in the industry, this LDO regulator is ideal for a variety of applications. With its compact design and superior performance, it provides customers with exceptional value and benefits. Trust Onsemi to deliver cutting-edge technology and innovative solutions for your power management needs. Choose the NCV8502D100R2 and experience the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the components inside, ensuring a longer lifespan for the product.

Maximum Dropout Voltage: 1.6 V

Low dropout voltage ensures efficient power conversion, making this regulator suitable for applications where power efficiency is critical.

Surface Mount: YES

Being surface mountable makes installation easier and saves space on the PCB, ideal for compact electronic devices.

Operating Temperature (TJ-Max): 150 °C

With a high maximum operating temperature, this regulator can perform reliably even in harsh environments with elevated temperatures.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high reliability and quality, making this regulator suitable for automotive applications where robustness is crucial.

Technology: BIPOLAR

Bipolar technology offers better stability and lower noise output compared to other technologies, making this regulator suitable for sensitive electronic devices.

Technical Specifications

Fixed Regulators - Positive Single Output LDO NCV8502D100R2 attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Onsemi

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.6 V

Nominal Dropout Voltage-1:

.4 V

Maximum Input Voltage Absolute:

Maximum Input Voltage:

26 V

Minimum Input Voltage:

11 V

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

4.9 mm

Maximum Line Regulation:

.06 %

Maximum Load Regulation:

.03 %

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

8

Operating Temperature (TJ-Max):

150 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.15 A

Maximum Output Voltage-1:

10.3 V

Minimum Output Voltage-1:

9.7 V

Nominal Output Voltage-1:

10 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

235

Qualification Status:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Voltage Tolerance:

3 %

Width:

3.9 mm

Trade Compliance

NCV8502D100R2 Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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