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NCV8133BMX120TCG

Onsemi

NCV8133BMX120TCG by Onsemi

Onsemi's NCV8133BMX120TCG is a CMOS LDO regulator with 1.2V output voltage, 0.5A output current, and 0.3V dropout voltage. Ideal for automotive applications due to AEC-Q100 screening level and small outline package style with extremely thin profile.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,147 parts In-Stock

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Digiode

USA . 819 parts In-Stock

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819

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Distributors (Availability)

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AZTECH Wire

Italy . 877 parts In-Stock

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$14.290

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877

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Authorized Procurement Solutions

USA . 15,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 11,417 parts In-Stock

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Microchip USA

USA . 4,858 parts In-Stock

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Problanco Electronics

Mexico . 4,696 parts In-Stock

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Perfect Parts

USA . 3,326 parts In-Stock

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TANS Electronics

Latvia . 2,342 parts In-Stock

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Corphita

USA . 1,587 parts In-Stock

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Kulean Microsystems

USA . 822 parts In-Stock

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Corohmni

South Africa . 396 parts In-Stock

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SupplyDigital Components

Austria . 154 parts In-Stock

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UHIMA Technologies

Türkiye . 108 parts In-Stock

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Overview

Enhance your electronic designs with the NCV8133BMX120TCG by Onsemi, a top-quality Fixed Regulator - Positive Single Output LDO. Manufactured by Onsemi, a trusted name in the industry, this product offers reliability and precision. Ideal for a wide range of applications, this regulator provides stable output voltage with minimal dropout voltage, ensuring optimal performance. With its compact design and high efficiency, customers can expect superior results in their projects. Upgrade your systems today with the NCV8133BMX120TCG and experience the difference in quality and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the regulator, ensuring long-term reliability.

Maximum Dropout Voltage-1: 1.3 V

Low dropout voltage ensures efficient power regulation, making this LDO suitable for applications with tight voltage requirements.

Surface Mount: YES

Ease of installation and space-saving design for PCBs.

Operating Temperature (TJ-Max): 125 °C

Wide operating temperature range allows for use in various environmental conditions.

Screening Level: AEC-Q100

Compliance with automotive industry standards ensures high reliability and performance, making it suitable for automotive applications.

Technology: CMOS

CMOS technology offers low power consumption and high efficiency, making it ideal for battery-powered devices.

Package Shape: SQUARE

Square package shape allows for easy PCB mounting and space-efficient layout.

Terminal Form: NO LEAD

Lead-free terminals are environmentally friendly and compliant with RoHS regulations.

Operating Temperature (TJ-Min): -40 °C

Wide temperature range ensures reliable operation in extreme cold conditions.

Minimum Output Voltage-1: 1.18 V

Low minimum output voltage allows for precise voltage regulation in low-power applications.

Maximum Voltage Tolerance: 1.5 %

Tight voltage tolerance ensures stable output voltage under varying load conditions.

Nominal Output Voltage-1: 1.2 V

Stable output voltage at the specified nominal value, suitable for sensitive electronic components.

No. of Terminals: 6

Sufficient number of terminals for connection to external components, ensuring ease of integration.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, EXTREMELY THIN PROFILE

Compact package design with heat sink/slugg enhances thermal performance and saves space on the PCB.

Adjustability: FIXED

Fixed output voltage simplifies design and eliminates the need for external adjustment circuitry.

Terminal Pitch: 0.4 mm

Narrow terminal pitch allows for high-density mounting on the PCB, ideal for space-constrained applications.

Regulator Type: FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

Specifically designed for stable voltage regulation in low-power applications, ensuring reliable performance.

Terminal Finish: MATTE TIN

Matte tin finish offers good solderability and corrosion resistance, ensuring long-term reliability.

Terminal Position: DUAL

Dual terminal position provides flexibility in PCB layout and ensures reliable electrical connections.

Maximum Output Voltage-1: 1.22 V

Close to nominal output voltage, ensuring accurate voltage regulation for connected components.

Maximum Seated Height: 0.45 mm

Low seated height allows for slim and compact device design, suitable for miniaturized applications.

Width: 1.2 mm

Narrow width saves space on the PCB and allows for high-density mounting.

Minimum Input Voltage: 1.5 V

Low minimum input voltage requirement makes it suitable for applications with limited power supply resources.

Maximum Output Current-1: 0.5 A

High maximum output current capability enables powering of a variety of components in the circuit.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for efficient reflow soldering process during manufacturing, ensuring proper solder joint formation.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures reliability during the soldering process.

Nominal Dropout Voltage-1: 0.14 V

Low dropout voltage minimizes power dissipation and ensures efficient energy conversion.

Length: 1.2 mm

Compact length saves space on the PCB and allows for high-density mounting.

Maximum Input Voltage: 5 V

Compatible with a wide range of input voltages, providing flexibility in power supply options.

Maximum Input Voltage Absolute: 6 V

High absolute maximum input voltage tolerance ensures protection against voltage transients and overvoltage conditions.

Technical Specifications

Fixed Regulators - Positive Single Output LDO NCV8133BMX120TCG attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Onsemi

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.3 V

Nominal Dropout Voltage-1:

.14 V

Maximum Input Voltage Absolute:

6 V

Maximum Input Voltage:

5 V

Minimum Input Voltage:

1.5 V

JESD-30 Code:

S-PDSO-N6

JESD-609 Code:

e3

Length:

1.2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

6

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.5 A

Maximum Output Voltage-1:

1.22 V

Minimum Output Voltage-1:

1.18 V

Nominal Output Voltage-1:

1.2 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.05,16

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, EXTREMELY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

.45 mm

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Voltage Tolerance:

Width:

1.2 mm

Trade Compliance

NCV8133BMX120TCG Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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