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NCV51411DR2

Onsemi

NCV51411DR2 by Onsemi

NCV51411DR2 by Onsemi is a switching regulator with max output current of 3A, operating temp range -40 to 125 °C, and max input voltage of 40V. Ideal for automotive applications due to its compact size and pulse width modulation control technique.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Chip Stock

USA . 15,880 parts In-Stock

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Vyrian

USA . 3,005 parts In-Stock

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Digiode

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AZTECH Wire

Italy . 908 parts In-Stock

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Problanco Electronics

Mexico . 7,917 parts In-Stock

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TANS Electronics

Latvia . 6,677 parts In-Stock

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Assy Fe

Spain . 2,500 parts In-Stock

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Corphita

USA . 1,740 parts In-Stock

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SupplyDigital Components

Austria . 836 parts In-Stock

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UHIMA Technologies

Türkiye . 534 parts In-Stock

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Vigor

Singapore . 261 parts In-Stock

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Microchip USA

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Kulean Microsystems

USA . 66 parts In-Stock

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Corohmni

South Africa . 59 parts In-Stock

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Overview

Enhance your electronic designs with the NCV51411DR2 by Onsemi, a top-of-the-line switching regulator and controller that delivers unparalleled performance and reliability. Onsemi, a trusted manufacturer in the industry, ensures superior quality and cutting-edge technology in every product. This versatile component is ideal for a wide range of applications, offering customers seamless integration, increased efficiency, and cost savings. Elevate your projects with the NCV51411DR2 and experience the difference in power management solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and reliability, making this product suitable for a wide range of applications.

Surface Mount: YES

Allows for easy and efficient assembly onto circuit boards, saving time and space in the overall design.

Package Shape: RECTANGULAR

The rectangular shape allows for easy placement and integration into existing designs and layouts.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand demanding and high-temperature environments.

Control Mode: CURRENT/VOLTAGE-MODE

The current/voltage-mode control allows for flexibility in regulating the output, accommodating different usage scenarios.

Technology: BIPOLAR

Bipolar technology ensures stable and efficient operation, making this product reliable and suitable for various applications.

Switcher Config: BUCK

The buck configuration allows for efficient voltage conversion, making this product ideal for power-saving and energy-efficient designs.

Minimum Input Voltage: 4.5 V

With a low minimum input voltage, this product can be used in applications where power source fluctuation is a concern.

Maximum Input Voltage: 40 V

The high maximum input voltage capability provides versatility and compatibility with a wide range of power sources.

Technical Specifications

Switching Regulators & Controllers NCV51411DR2 attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

CURRENT/VOLTAGE-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

40 V

Minimum Input Voltage:

4.5 V

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

3 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

BUCK

Maximum Switching Frequency:

296 kHz

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

3.9 mm

Trade Compliance

NCV51411DR2 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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