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NCV4949DR2G

Onsemi

NCV4949DR2G by Onsemi

Onsemi's NCV4949DR2G is a fixed positive single output LDO regulator with a nominal output voltage of 5V and max dropout voltage of 0.5V. Operating temperature ranges from -40 °C to 125°C, making it suitable for automotive applications meeting AEC-Q100 standards. This surface-mount device has a compact rectangular package style with Gull Wing terminals, ideal for space-constrained designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Cyclops Electronics Ltd

UK . 4,600 parts In-Stock

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Vyrian

USA . 3,511 parts In-Stock

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Digiode

USA . 946 parts In-Stock

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Vigor

Singapore . 562 parts In-Stock

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$0.850

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562

$0.850

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AZTECH Wire

Italy . 506 parts In-Stock

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$17.300

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506

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Kepictronics

USA . 25,854 parts In-Stock

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Authorized Procurement Solutions

USA . 25,000 parts In-Stock

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Kulean Microsystems

USA . 4,863 parts In-Stock

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SupplyDigital Components

Austria . 4,081 parts In-Stock

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TANS Electronics

Latvia . 1,958 parts In-Stock

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Assy Fe

Spain . 1,624 parts In-Stock

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Corphita

USA . 903 parts In-Stock

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Futuretech Components

Singapore . 673 parts In-Stock

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UHIMA Technologies

Türkiye . 544 parts In-Stock

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Microchip USA

USA . 457 parts In-Stock

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Problanco Electronics

Mexico . 287 parts In-Stock

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Corohmni

South Africa . 252 parts In-Stock

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Overview

Discover the NCV4949DR2G by Onsemi, a top-quality fixed positive single output LDO regulator that guarantees reliable performance and efficiency. Designed with AEC-Q100 screening, this product is perfect for automotive applications. With a nominal output voltage of 5V and maximum dropout voltage of just 0.5V, customers can trust in its precision and stability. Enjoy the benefits of a compact design, high voltage tolerance, and minimal load regulation. Trust Onsemi to deliver cutting-edge technology that meets your power regulation needs seamlessly.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the package lightweight and durable, ensuring reliability in various applications.

Maximum Dropout Voltage: 1.5 V

Low dropout voltage ensures efficient power conversion with minimal power loss, making it suitable for applications requiring stable output voltage.

Surface Mount: YES

Surface mount design allows for easy and convenient installation on PCBs, saving space and reducing assembly time.

Operating Temperature (TJ-Max): 125 °C

Wide operating temperature range up to 125 °C enables reliable performance in harsh environments and high-temperature applications.

Technology: BIPOLAR

Bipolar technology ensures stable and accurate voltage regulation, making it suitable for precision electronics and critical systems.

Adjustability: FIXED

Fixed output voltage eliminates the need for external adjustments, simplifying the design and reducing component count.

Maximum Load Regulation: 0.03 %

Low load regulation ensures stable output voltage under varying load conditions, making it suitable for applications with dynamic power requirements.

Maximum Input Voltage: 28 V

High input voltage tolerance of 28V allows for versatile power supply compatibility in a wide range of applications.

Technical Specifications

Fixed Regulators - Positive Single Output LDO NCV4949DR2G attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Onsemi

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.5 V

Nominal Dropout Voltage-1:

.3 V

Maximum Input Voltage Absolute:

Maximum Input Voltage:

28 V

Minimum Input Voltage:

6 V

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Maximum Line Regulation:

.02 %

Maximum Load Regulation:

.03 %

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

8

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current-1:

.1 A

Maximum Output Voltage-1:

5.1 V

Minimum Output Voltage-1:

4.9 V

Nominal Output Voltage-1:

5 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Qualification Status:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Maximum Voltage Tolerance:

2 %

Width:

3.9 mm

Trade Compliance

NCV4949DR2G Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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