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NCV4269DWR2G

Onsemi

NCV4269DWR2G by Onsemi

Onsemi's NCV4269DWR2G is a fixed positive single output LDO regulator with 5V nominal output voltage and 0.15A max output current. It features a small outline package style, operates b/w -40 to 125 °C, and has a max dropout voltage of 0.5V. Ideal for automotive applications due to AEC-Q100 screening level.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,086 parts In-Stock

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Vyrian

USA . 2,080 parts In-Stock

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Vigor

Singapore . 186 parts In-Stock

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$0.770

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AZTECH Wire

Italy . 866 parts In-Stock

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$15.910

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Kulean Microsystems

USA . 7,390 parts In-Stock

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Problanco Electronics

Mexico . 6,594 parts In-Stock

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TANS Electronics

Latvia . 5,343 parts In-Stock

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Microchip USA

USA . 4,580 parts In-Stock

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Authorized Procurement Solutions

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SupplyDigital Components

Austria . 2,837 parts In-Stock

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Corphita

USA . 1,785 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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UHIMA Technologies

Türkiye . 949 parts In-Stock

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Futuretech Components

Singapore . 674 parts In-Stock

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South Africa . 91 parts In-Stock

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Overview

Enhance your electronic designs with the NCV4269DWR2G by Onsemi, a top-quality fixed positive single output LDO regulator that offers unparalleled reliability and performance. Manufactured by Onsemi, a trusted industry leader, this regulator is ideal for a wide range of applications, delivering precise voltage regulation with minimal dropout voltage. Whether you're working on automotive electronics or consumer devices, this product provides consistent output voltage and superior line and load regulation. Trust Onsemi's expertise and elevate your projects with the NCV4269DWR2G today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this regulator lightweight and durable, ideal for various electronic applications.

Maximum Dropout Voltage-1: 1.5 V

With a low dropout voltage, this regulator can maintain a stable output voltage even when the input voltage is close to the output voltage, ensuring reliable performance.

Surface Mount: YES

Being surface mountable, this regulator is easy to install on PCBs, saving space and facilitating automated assembly processes.

Operating Temperature (TJ-Max): 125 °C

With a high operating temperature range, this regulator can function effectively in various environmental conditions.

Screening Level: AEC-Q100

Compliance with AEC-Q100 ensures that this regulator meets automotive industry standards, making it suitable for automotive applications.

Technology: BIPOLAR

The bipolar technology used in this regulator provides accurate and stable output voltage regulation, enhancing the overall performance of the device.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for efficient space utilization on the PCB, making it a practical choice for compact electronic designs.

Terminal Form: GULL WING

The gull-wing terminal form enhances the mechanical stability of the regulator during soldering and assembly processes, ensuring reliable connections.

Operating Temperature (TJ-Min): -40 °C

The low minimum operating temperature makes this regulator suitable for use in extreme cold environments without compromising performance.

Packing Method: TR

The TR packing method provides secure and convenient packaging for transportation and storage, safeguarding the regulator from damage.

Technical Specifications

Fixed Regulators - Positive Single Output LDO NCV4269DWR2G attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Onsemi

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.5 V

Nominal Dropout Voltage-1:

.25 V

Maximum Input Voltage Absolute:

Maximum Input Voltage:

26 V

Minimum Input Voltage:

6 V

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

12.8 mm

Maximum Line Regulation:

.03 %

Maximum Load Regulation:

.02 %

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

20

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.15 A

Maximum Output Voltage-1:

5.1 V

Minimum Output Voltage-1:

4.9 V

Nominal Output Voltage-1:

5 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification Status:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

2.65 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Voltage Tolerance:

2 %

Width:

7.5 mm

Trade Compliance

NCV4269DWR2G Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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