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NCV4264ST50T3G

Onsemi

NCV4264ST50T3G by Onsemi

NCV4264ST50T3G by Onsemi is a fixed positive single output LDO regulator with a nominal output voltage of 5V and max dropout voltage of 0.5V, suitable for applications requiring stable voltage regulation in automotive environments. It features a max output current of 0.15A, operating temperature range from -40 °C to 150°C, and AEC-Q100 screening level for reliable performance.

Median Price

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Lifecycle Status

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8

In-Stock Inventory

1k+

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ACDS - Activité Composants Distribution Service

France . 6,391 parts In-Stock

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Vyrian

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Q Components

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Cyclops Electronics Ltd

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ComSIT Distribution GmbH

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ComSIT USA

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Digiode

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Vigor

Singapore . 730 parts In-Stock

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$0.700

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AZTECH Wire

Italy . 452 parts In-Stock

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$13.180

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Kepictronics

USA . 27,860 parts In-Stock

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Authorized Procurement Solutions

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TANS Electronics

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Problanco Electronics

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Glotronic Ltd.

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SupplyDigital Components

Austria . 2,297 parts In-Stock

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Corphita

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Kulean Microsystems

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Microchip USA

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Overview

Unlock the potential of your electronic devices with the NCV4264ST50T3G by Onsemi, a top-quality fixed regulator that ensures reliable performance and efficiency. Manufactured by Onsemi, a trusted industry leader, this LDO regulator is perfect for a wide range of applications. With its advanced technology and precise voltage regulation, this product guarantees optimal power supply to your devices. Experience the value and benefits of the NCV4264ST50T3G by Onsemi today and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the internal components of the regulator, ensuring long-term reliability.

Maximum Dropout Voltage: 1.5 V

This low dropout voltage allows the regulator to maintain a stable output voltage even when the input voltage fluctuates, providing consistent performance.

Surface Mount: YES

The surface mount option makes installation of the regulator easy and efficient, saving time and effort during assembly.

Operating Temperature (TJ-Max): 150 °C

With a high maximum operating temperature, this regulator can be used in a variety of environments without overheating or performance degradation.

Screening Level: AEC-Q100

This screening level ensures that the regulator meets automotive industry standards for quality and reliability, making it suitable for automotive applications.

Technology: BIPOLAR

The bipolar technology used in this regulator provides precise voltage regulation and low noise, making it ideal for sensitive electronic devices.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration into circuit designs, saving space and providing a clean layout.

Terminal Form: GULL WING

The gull wing terminal form offers secure connections and easy soldering during assembly, ensuring stable performance of the regulator.

Operating Temperature (TJ-Min): -40 °C

With a low minimum operating temperature, this regulator can be used in cold environments without experiencing performance issues.

Packing Method: TR

The tape and reel packing method simplifies storage and handling of the regulators, making it convenient for manufacturing processes.

Technical Specifications

Fixed Regulators - Positive Single Output LDO NCV4264ST50T3G attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Onsemi

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.5 V

Nominal Dropout Voltage-1:

.275 V

Maximum Input Voltage Absolute:

Maximum Input Voltage:

45 V

Minimum Input Voltage:

4.5 V

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Length:

6.5 mm

Maximum Line Regulation:

.03 %

Maximum Load Regulation:

.04 %

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

3

Operating Temperature (TJ-Max):

150 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.15 A

Maximum Output Voltage-1:

5.1 V

Minimum Output Voltage-1:

4.9 V

Nominal Output Voltage-1:

5 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOT-223

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Qualification Status:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

2.3 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Maximum Voltage Tolerance:

2 %

Width:

3.5 mm

Trade Compliance

NCV4264ST50T3G Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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