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NCV33269DTRK-12

Onsemi

NCV33269DTRK-12 by Onsemi

NCV33269DTRK-12 by Onsemi is a fixed positive single output LDO regulator with a nominal output voltage of 12V and max output current of 0.8A. It operates in an extended temperature range from -40 to 150 °C, making it suitable for automotive applications meeting AEC-Q100 standards. The package style is small outline, surface mountable, with a gull wing terminal form for easy PCB integration.

Median Price

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1k+

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SupplyDigital Components

Austria . 7,101 parts In-Stock

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Problanco Electronics

Mexico . 6,699 parts In-Stock

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TANS Electronics

Latvia . 6,630 parts In-Stock

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Kulean Microsystems

USA . 2,160 parts In-Stock

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Corphita

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UHIMA Technologies

Türkiye . 737 parts In-Stock

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Corohmni

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Overview

Enhance your electronic designs with the high-quality NCV33269DTRK-12 fixed regulator by Onsemi. Manufactured using cutting-edge technology and AEC-Q100 screening, this LDO regulator delivers reliable performance in a compact package. Ideal for a range of applications, this product offers a stable 12V output with minimal dropout voltage, ensuring efficient power delivery. Trust Onsemi to provide top-notch components that meet your needs for precision, reliability, and value. Elevate your projects with the NCV33269DTRK-12 and experience the benefits of superior quality and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the regulator easy to handle and long-lasting.

Maximum Dropout Voltage: 1.35 V

Low dropout voltage ensures minimal energy loss and efficient power delivery.

Surface Mount: YES

Surface mount capability allows for easy integration into circuit boards, saving space and simplifying assembly.

Operating Temperature (TJ-Max): 150 °C

Wide operating temperature range ensures reliable performance in various environmental conditions.

Screening Level: AEC-Q100

Compliance with AEC-Q100 standards ensures high quality and reliability, suitable for automotive applications.

Technology: BIPOLAR

Bipolar technology offers stable output voltage and low noise, ideal for sensitive electronic devices.

Package Shape: RECTANGULAR

Rectangular shape allows for easy placement and integration into existing designs.

Operating Temperature (TJ-Min): -40 °C

Wide temperature range allows for operation in extreme cold conditions.

Nominal Output Voltage: 12 V

Stable output voltage ensures consistent power supply to connected devices.

Maximum Output Current: 0.8 A

High maximum output current capability allows for powering a range of devices.

Technical Specifications

Fixed Regulators - Positive Single Output LDO NCV33269DTRK-12 attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Onsemi

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

1.35 V

Nominal Dropout Voltage-1:

1.1 V

Maximum Input Voltage Absolute:

Maximum Input Voltage:

20 V

Minimum Input Voltage:

13.5 V

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e0

Length:

6.54 mm

Maximum Line Regulation:

.036 %

Maximum Load Regulation:

.06 %

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

2

Operating Temperature (TJ-Max):

150 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.8 A

Maximum Output Voltage-1:

12.24 V

Minimum Output Voltage-1:

11.76 V

Nominal Output Voltage-1:

12 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SMSIP3H,.38,90TB

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Qualification Status:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

2.38 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.29 mm

Terminal Position:

SINGLE

Maximum Voltage Tolerance:

2 %

Width:

6.16 mm

Trade Compliance

NCV33269DTRK-12 Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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