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NCV3011DTBR2G

Onsemi

NCV3011DTBR2G by Onsemi

NCV3011DTBR2G by Onsemi is a voltage-mode switching controller with 470 kHz max frequency. Operating from -40 to 125 °C, it suits automotive applications. With 14 terminals in a small outline package, it offers PWM control for push-pull switcher configuration.

Median Price

$0.722

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 21 parts In-Stock

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$0.568

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$0.568

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Chip1Stop

Japan . 21 parts In-Stock

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$0.859

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$0.859

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Mouser Electronics

USA . 4,590 parts In-Stock

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$1.030

100+ parts

$0.804

1k+ parts

$0.674

10k+ parts

$0.663

4,590

$1.030

$0.804

$0.674

$0.663

Flip Electronics (Authorized)

USA . 260,000 parts In-Stock

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DigiKey

USA . 5,000 parts In-Stock

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$0.722

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$0.722

Verical

USA . 21 parts In-Stock

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$0.568

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21

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$0.568

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Distributors (In-Stock)

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Digiode

USA . 1,883 parts In-Stock

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$0.546

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1,883

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Vyrian

USA . 1,142 parts In-Stock

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$0.575

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Flip Electronics

USA . 260,000 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 39,560 parts In-Stock

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$0.489

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39,560

$0.489

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Corphita

USA . 592 parts In-Stock

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$0.518

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592

$0.518

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Corohmni

South Africa . 370 parts In-Stock

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$0.575

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370

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Kepictronics

USA . 41,000 parts In-Stock

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Perfect Parts

USA . 15,104 parts In-Stock

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SupplyDigital Components

Austria . 4,960 parts In-Stock

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4,960

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Kulean Microsystems

USA . 4,503 parts In-Stock

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Problanco Electronics

Mexico . 3,940 parts In-Stock

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TANS Electronics

Latvia . 850 parts In-Stock

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UHIMA Technologies

Türkiye . 278 parts In-Stock

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278

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Overview

Unleash the power of efficient voltage regulation with the NCV3011DTBR2G by Onsemi. Crafted with precision and expertise, this switching regulator offers unrivaled performance in a compact package. Ideal for automotive applications, this product ensures reliable and stable power supply, guaranteeing optimal functionality. Say goodbye to power fluctuations and hello to seamless operations with the NCV3011DTBR2G. Upgrade your systems today and experience the difference that quality engineering can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability for long-term use.

Surface Mount: YES

Surface mount design allows for easy and compact installation on circuit boards.

No. of Terminals: 14

Having 14 terminals allows for versatile connections and functionality.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125 °C, this product can withstand high temperature environments.

Control Mode: VOLTAGE-MODE

Voltage-mode control provides precise regulation and stability in voltage output.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold finish offers excellent conductivity and corrosion resistance.

Width (mm): 4.4 mm

Compact width of 4.4mm ensures space-saving design in electronics applications.

Nominal Input Voltage: 12 V

Compatible with a wide range of input voltages, making it versatile for different power sources.

Maximum Switching Frequency: 470 kHz

High switching frequency allows for efficient power conversion and minimal losses.

Control Technique: PULSE WIDTH MODULATION

Pulse width modulation control technique provides precise control over the output voltage.

Moisture Sensitivity Level (MSL): 3

MSL level of 3 indicates resistance to moisture, ensuring product reliability in various environments.

Minimum Input Voltage: 4.7 V

Low minimum input voltage requirement enables operation with low-power sources.

Technical Specifications

Switching Regulators & Controllers NCV3011DTBR2G attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Additional Features:

ADJUSTABLE OUTPUT VOLTAGE DOWN TO 0.8V

Other IC type:

Control Mode:

VOLTAGE-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

28 V

Minimum Input Voltage:

4.7 V

Nominal Input Voltage:

12 V

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

PUSH-PULL

Maximum Switching Frequency:

470 kHz

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4.4 mm

Trade Compliance

NCV3011DTBR2G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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