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NCT7290MNTXG

Onsemi

NCT7290MNTXG by Onsemi

NCT7290MNTXG by Onsemi is a 12-bit temperature sensor with a max supply voltage of 3.6V and accuracy of 3.5 °C. It is ideal for applications requiring precise temperature monitoring in a compact square package, suitable for surface mount installations.

Median Price

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Lifecycle Status

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Vyrian

USA . 7,507 parts In-Stock

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Digiode

USA . 964 parts In-Stock

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AZTECH Wire

Italy . 125 parts In-Stock

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$9.080

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QUARKTWIN TECHNOLOGY LTD

USA . 23,738 parts In-Stock

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Problanco Electronics

Mexico . 7,082 parts In-Stock

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TANS Electronics

Latvia . 4,760 parts In-Stock

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Kulean Microsystems

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SupplyDigital Components

Austria . 2,079 parts In-Stock

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UHIMA Technologies

Türkiye . 595 parts In-Stock

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Microchip USA

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Corohmni

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Corphita

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Overview

Experience precise temperature monitoring and control with the NCT7290MNTXG by Onsemi. As a leading manufacturer in the industry, Onsemi's temperature sensors are known for their reliability and accuracy. This versatile sensor is perfect for a wide range of applications, offering customers peace of mind with its high-quality performance. Whether you need to monitor temperature in your home, office, or industrial setting, the NCT7290MNTXG provides the value, benefits, and advantages you need to ensure optimal temperature regulation. Trust Onsemi for all your temperature sensing needs.

Feature Benefit Bullets

Maximum Supply Voltage: 3.6 V

A higher maximum supply voltage allows for more flexibility in the power source options, making this product suitable for a variety of applications.

No. of Bits: 12

With a higher number of bits, this temperature sensor can offer more precise and accurate temperature readings, making it a reliable choice for temperature measurement.

Body Width: 8 inch

The compact body width of 8 inches allows for easy integration and installation in various devices or systems, making it a versatile option for temperature sensing.

Sensors or Transducers Type: TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL

This sensor offers multiple output options including switch, digital output, and serial communication, providing versatility in connecting with different types of systems.

Body Height: 0.9 mm

The low body height of 0.9 mm enables this sensor to be used in applications where space is limited, making it a practical choice for compact designs.

Package Shape or Style: SQUARE

The square package shape or style of this sensor provides a stable and secure mounting option, ensuring reliable performance in various environments.

Minimum Supply Voltage: 3 V

The low minimum supply voltage requirement of 3 V helps in minimizing power consumption, making this sensor energy-efficient and cost-effective to operate.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125 °C, this sensor can withstand higher temperature conditions, expanding its range of applications.

Minimum Operating Temperature: -55 °C

The wide operating temperature range starting from -55 °C ensures this sensor can be used in both extreme cold and hot environments, enhancing its versatility.

Maximum Operating Current: 5 mA

The low maximum operating current of 5 mA helps in reducing power consumption and heat generation, making this sensor suitable for battery-powered devices or applications with strict power constraints.

Maximum Accuracy °C: 3.5

With a high maximum accuracy of 3.5 °C, this sensor provides precise temperature readings, making it reliable for applications where accuracy is critical.

Body Length/Diameter: 8 mm

The compact body length or diameter of 8 mm allows for easy installation and integration in various systems or devices, making this sensor a practical choice for temperature measurement.

Termination Type: SOLDER

The solder termination type ensures secure connections and reliable performance, making this sensor suitable for applications where stability and durability are important.

Output Interface Type: 4-WIRE INTERFACE

The 4-wire interface type provides a stable and robust communication link, ensuring accurate data transmission between the sensor and the connected system.

Mounting Feature: SURFACE MOUNT

The surface mounting feature allows for easy and secure installation on PCBs or other surfaces, making this sensor suitable for compact and space-constrained designs.

Technical Specifications

Temperature Sensors NCT7290MNTXG attributes and parameters. Explore more Temperature Sensors devices from Onsemi

Specs

Maximum Accuracy (Cel):

3.5

Body Width:

8 inch

Body Height:

.9 mm

Body Length/Diameter:

8 mm

Mounting Feature:

No. of Bits:

12

Maximum Operating Current:

5 mA

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Interface Type:

4-WIRE INTERFACE

Package Shape or Style:

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Termination Type:

SOLDER

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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