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NCT375DMR2G

Onsemi

NCT375DMR2G by Onsemi

NCT375DMR2G by Onsemi is a 12-bit temperature sensor with a supply voltage range of 3V to 5.5V. It operates b/w -55 °C to 125°C, offering an accuracy of 3°C. This square-shaped sensor with a surface mount feature is ideal for applications requiring precise temperature monitoring in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Flip Electronics

USA . 9,000 parts In-Stock

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Vyrian

USA . 2,027 parts In-Stock

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Digiode

USA . 54 parts In-Stock

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Ampacity Inc.

Singapore . 657 parts In-Stock

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$1.750

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657

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AZTECH Wire

Italy . 1,000 parts In-Stock

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$10.240

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$10.240

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Kulean Microsystems

USA . 7,088 parts In-Stock

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SupplyDigital Components

Austria . 6,613 parts In-Stock

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Problanco Electronics

Mexico . 5,288 parts In-Stock

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Corphita

USA . 1,864 parts In-Stock

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TANS Electronics

Latvia . 1,518 parts In-Stock

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UHIMA Technologies

Türkiye . 902 parts In-Stock

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Corohmni

South Africa . 332 parts In-Stock

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Overview

Discover the NCT375DMR2G by Onsemi, a high-quality temperature sensor offering precision and reliability. Manufactured by Onsemi, a trusted name in the industry, this sensor is perfect for applications requiring accurate temperature monitoring. With a wide supply voltage range and compact design, this sensor is versatile and easy to integrate. Experience peace of mind knowing your temperature measurements are accurate with the NCT375DMR2G.

Feature Benefit Bullets

Maximum Supply Voltage: 5.5 V

Allows for a wide range of applications and compatibility with various systems.

No. of Bits: 12

Higher resolution and accuracy in temperature measurement.

Body Width: 3 inch

Compact size for easy integration into different devices.

Sensors or Transducers Type: TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL

Versatile functionality for different temperature sensing and control applications.

Body Height: 1.1 mm

Low profile design for space-constrained environments.

Package Shape or Style: SQUARE

Easy to mount and secure in place.

Minimum Supply Voltage: 3 V

Wide operating range for different power supply options.

Maximum Operating Temperature: 125 °C

Suitable for high-temperature environments.

Minimum Operating Temperature: -55 °C

Suitable for low-temperature environments.

Terminal Finish: Matte Tin (Sn) - annealed

Corrosion-resistant finish for durability.

Maximum Operating Current: 0.8 mA

Low power consumption for energy-efficient operation.

Maximum Accuracy °C: 3

High accuracy in temperature measurements for precise control.

Body Length/Diameter: 3 mm

Compact design for easy installation.

Termination Type: SOLDER

Secure connection for reliable performance.

Output Interface Type: 2-WIRE INTERFACE

Standard interface for easy connectivity with other systems.

Mounting Feature: SURFACE MOUNT

Convenient mounting option for different applications.

Technical Specifications

Temperature Sensors NCT375DMR2G attributes and parameters. Explore more Temperature Sensors devices from Onsemi

Specs

Maximum Accuracy (Cel):

3

Body Width:

3 inch

Body Height:

1.1 mm

Body Length/Diameter:

3 mm

JESD-609 Code:

e3

Mounting Feature:

No. of Bits:

12

Maximum Operating Current:

.8 mA

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Interface Type:

2-WIRE INTERFACE

Package Shape or Style:

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Terminal Finish:

Matte Tin (Sn) - annealed

Termination Type:

SOLDER

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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