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NCS5650MNTXG

Onsemi

NCS5650MNTXG by Onsemi

NCS5650MNTXG by Onsemi is a Line Driver with 2 functions, operating at -40 to 125 °C. It has a supply voltage range of 3-12 V and features differential input characteristics. This automotive-grade IC is ideal for applications requiring high-speed signal transmission in compact spaces.

Median Price

$2.300

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 1 parts In-Stock

1+ parts

$55.600

100+ parts

-

1k+ parts

-

10k+ parts

-

1

$55.600

-

-

-

Verical

USA . 664 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.300

10k+ parts

-

664

-

-

$2.300

-

Rochester

USA . 507 parts In-Stock

1+ parts

-

100+ parts

$1.750

1k+ parts

$1.560

10k+ parts

$1.470

507

-

$1.750

$1.560

$1.470

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,660 parts In-Stock

1+ parts

$1.852

100+ parts

-

1k+ parts

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1,660

$1.852

-

-

-

Vyrian

USA . 2,244 parts In-Stock

1+ parts

-

100+ parts

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2,244

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-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 65 parts In-Stock

1+ parts

$1.755

100+ parts

-

1k+ parts

-

10k+ parts

-

65

$1.755

-

-

-

Vigor

Singapore . 360 parts In-Stock

1+ parts

$1.870

100+ parts

-

1k+ parts

-

10k+ parts

-

360

$1.870

-

-

-

Corohmni

South Africa . 117 parts In-Stock

1+ parts

$1.950

100+ parts

-

1k+ parts

-

10k+ parts

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117

$1.950

-

-

-

AZTECH Wire

Italy . 469 parts In-Stock

1+ parts

$15.090

100+ parts

-

1k+ parts

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469

$15.090

-

-

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SupplyDigital Components

Austria . 7,780 parts In-Stock

1+ parts

-

100+ parts

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7,780

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-

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Kulean Microsystems

USA . 3,250 parts In-Stock

1+ parts

-

100+ parts

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3,250

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-

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Problanco Electronics

Mexico . 2,997 parts In-Stock

1+ parts

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100+ parts

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2,997

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Continental Prestige Electronics

USA . 664 parts In-Stock

1+ parts

-

100+ parts

$2.310

1k+ parts

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10k+ parts

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664

-

$2.310

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Microchip USA

USA . 411 parts In-Stock

1+ parts

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100+ parts

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411

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UHIMA Technologies

Türkiye . 324 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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324

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-

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TANS Electronics

Latvia . 272 parts In-Stock

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272

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Kepictronics

USA . 170 parts In-Stock

1+ parts

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170

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Perfect Parts

USA . 6 parts In-Stock

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6

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Overview

Enhance your automotive applications with the NCS5650MNTXG by Onsemi, a reliable and high-quality line driver that delivers peak performance. With a maximum supply voltage of 6V and a wide temperature range, this product is perfect for demanding environments. Onsemi's reputation for excellence ensures that you are getting a top-notch solution for your needs. Experience seamless communication and efficient signal transmission with the NCS5650MNTXG, providing value and reliability with every use. Upgrade your systems today and see the difference for yourself!

Feature Benefit Bullets

Surface Mount: YES

Easy to mount on PCB, saves space and makes it suitable for small form factor applications.

Maximum Supply Voltage: 6 V

Safe operating voltage range which can help prevent damage to the device.

No. of Functions: 2

Versatile product with multiple functions for enhanced functionality.

Package Shape: SQUARE

Uniform shape for easy integration into circuit design and layout.

Power Supplies (V): 12

Stable power supply for reliable performance.

No. of Terminals: 20

Sufficient terminals for connectivity options and flexibility in circuit design.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Multiple package styles provide options for different mounting and cooling requirements.

Minimum Supply Voltage: 3 V

Allows for operation at lower voltages for energy efficiency.

Maximum Operating Temperature: 125 °C

High operating temperature range suitable for demanding environments.

Minimum Operating Temperature: -40 °C

Wide range of operating temperatures for versatility in outdoor or industrial applications.

Terminal Finish: TIN

Tin finish for good solderability and electrical conductivity.

Terminal Position: QUAD

Quad terminal arrangement for enhanced connectivity and signal integrity.

Maximum Seated Height: 1 mm

Low profile design for space-constrained applications.

Width: 4 mm

Compact width for easy integration into PCB layouts.

Peak Reflow Temperature °C: 260

High reflow temperature for reliable soldering during assembly.

Length: 4 mm

Compact length for space-saving design.

Temperature Grade: AUTOMOTIVE

Suitable for automotive applications with temperature and performance requirements.

Maximum Receive Delay: 0 ns

Zero receive delay ensures real-time data transmission.

Terminal Form: NO LEAD

Lead-free terminal form for environmentally friendly manufacturing.

Input Characteristics: DIFFERENTIAL

Differential inputs for noise immunity and improved signal integrity.

Nominal Supply Voltage: 12 V

Stable nominal voltage for consistent performance.

Terminal Pitch: 0.5 mm

Fine terminal pitch for high-density PCB designs.

Driver No. of Bits: 2

Dual driver with 2 bits for versatile signal processing.

Interface IC Type: LINE DRIVER

Specifically designed as a line driver, providing reliable signal amplification and transmission capabilities.

Technical Specifications

Line Drivers & Receivers NCS5650MNTXG attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Differential Output:

NO

Driver No. of Bits:

2

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

S-XQCC-N20

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC20,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Maximum Seated Height:

1 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Voltage:

6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

4 mm

Trade Compliance

NCS5650MNTXG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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