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NCP81210AMNTXG

Onsemi

NCP81210AMNTXG by Onsemi

NCP81210AMNTXG by Onsemi is a 40-terminal switching controller with a max switching frequency of 1200 kHz. It operates b/w -10 °C to 100°C, using current-mode control technique for applications requiring precise power regulation in compact spaces. The chip carrier package style with matte tin finish and no lead terminal form makes it suitable for surface mount designs with limited height constraints.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 8,485 parts In-Stock

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Digiode

USA . 794 parts In-Stock

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AZTECH Wire

Italy . 1,101 parts In-Stock

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Kepictronics

USA . 81,000 parts In-Stock

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Authorized Procurement Solutions

USA . 50,000 parts In-Stock

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SupplyDigital Components

Austria . 4,847 parts In-Stock

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Kulean Microsystems

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Problanco Electronics

Mexico . 1,397 parts In-Stock

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Corphita

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UHIMA Technologies

Türkiye . 695 parts In-Stock

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TANS Electronics

Latvia . 146 parts In-Stock

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Corohmni

South Africa . 124 parts In-Stock

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Microchip USA

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Overview

Unlock the potential of your electronics with the NCP81210AMNTXG by Onsemi. This cutting-edge switching regulator and controller offers unparalleled performance and reliability, thanks to Onsemi's reputation for top-notch quality. Ideal for a wide range of applications, this product delivers value by providing efficient power management and precise control. Say goodbye to energy waste and hello to optimized performance with the NCP81210AMNTXG - the perfect choice for all your power regulation needs.

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability makes the product easy to integrate onto circuit boards, saving space and simplifying the assembly process.

Nominal Supply Voltage (Vsup): 5 V

Operating at a common 5V supply voltage allows for compatibility with a wide range of electronic systems and components.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature of 100 °C, this product can withstand demanding environmental conditions and ensure reliable performance.

Control Mode: CURRENT-MODE

The current-mode control technique helps to regulate the output current accurately, providing stability and efficiency in the power supply system.

Maximum Switching Frequency: 1200 kHz

A high maximum switching frequency of 1200 kHz enables fast response times and efficient operation, making the product suitable for high-performance applications.

Technical Specifications

Switching Regulators & Controllers NCP81210AMNTXG attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

JESD-30 Code:

S-XQCC-N40

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-10 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC40,.2SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Current (Isup):

13 mA

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Maximum Switching Frequency:

1200 kHz

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

5 mm

Trade Compliance

NCP81210AMNTXG Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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