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NCP81039MNTWG

Onsemi

NCP81039MNTWG by Onsemi

NCP81039MNTWG by Onsemi is a voltage-mode switching regulator with max. operating temp of 100 °C and freq. of 330 kHz. Ideal for industrial applications, it comes in a square chip carrier package with 20 terminals, tin finish, and operates b/w -40 to 100°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 5,522 parts In-Stock

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Digiode

USA . 1,323 parts In-Stock

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AZTECH Wire

Italy . 938 parts In-Stock

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$8.260

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Component Stockers USA

USA . 410 parts In-Stock

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$99.990

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SupplyDigital Components

Austria . 7,428 parts In-Stock

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TANS Electronics

Latvia . 4,713 parts In-Stock

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Problanco Electronics

Mexico . 3,591 parts In-Stock

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Kulean Microsystems

USA . 3,165 parts In-Stock

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Corphita

USA . 1,929 parts In-Stock

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UHIMA Technologies

Türkiye . 666 parts In-Stock

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Corohmni

South Africa . 451 parts In-Stock

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Microchip USA

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Overview

Experience the superior quality and reliability of Onsemi with the NCP81039MNTWG Switching Regulator & Controller. This innovative product offers a wide range of applications, providing customers with versatility and performance. With its advanced design and cutting-edge technology, this regulator ensures efficient power management and precise control. Say goodbye to inconsistent power supply issues and hello to seamless operation with the NCP81039MNTWG by Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good electrical insulation and thermal conductivity, ensuring reliable performance in various operating conditions.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly on circuit boards, saving time and costs in production.

Package Shape: SQUARE

Square shape provides a compact design that can easily fit into tight spaces, making it suitable for applications with limited board space.

No. of Terminals: 20

Having 20 terminals allows for more connections and flexibility in circuit design, enabling a wide range of applications.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers high reliability and excellent thermal performance, making it ideal for demanding industrial applications.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions without sacrificing performance.

Control Mode: VOLTAGE-MODE

Voltage-mode control allows for precise regulation of output voltage, ensuring stability and efficiency in power conversion.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for reliable operation in cold environments, making it suitable for a wide range of applications.

Terminal Finish: Tin (Sn)

Tin terminal finish provides good solderability and corrosion resistance, ensuring long-term reliability in various operating conditions.

Terminal Position: QUAD

Quad terminal position facilitates easier and more secure connections, reducing the risk of signal interference and improving overall performance.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh industrial environments, making it suitable for industrial applications.

Maximum Switching Frequency: 330 kHz

High maximum switching frequency allows for faster response times and better efficiency in power conversion, making it ideal for high-speed applications.

Terminal Form: NO LEAD

No lead terminal form is environmentally friendly and complies with RoHS regulations, making it a sustainable choice for electronic products.

Terminal Pitch: 0.4 mm

Fine terminal pitch of 0.4mm enables high-density mounting and precise connections, making it suitable for compact designs and miniaturized electronics.

Technical Specifications

Switching Regulators & Controllers NCP81039MNTWG attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Control Mode:

VOLTAGE-MODE

JESD-30 Code:

S-PQCC-N20

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

20

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC20,.11SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Maximum Switching Frequency:

330 kHz

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

NO LEAD

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Trade Compliance

NCP81039MNTWG Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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