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NCP5371MNR2G

Onsemi

NCP5371MNR2G by Onsemi

NCP5371MNR2G by Onsemi is a Power Management IC with 10mA supply current and 4.5V ~ 5.5V supply voltage, suitable for Processor applications. Operating temperature ranges from -40 °C to 85°C, housed in a 48-VFQFN Exposed Pad package for surface mount assembly.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

NCP5371MNR2G by Onsemi
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Distributors (In-Stock)

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Vyrian

USA . 4,471 parts In-Stock

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Digiode

USA . 1,143 parts In-Stock

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AZTECH Wire

Italy . 874 parts In-Stock

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$15.390

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874

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Component Stockers USA

USA . 595 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 29,006 parts In-Stock

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TANS Electronics

Latvia . 8,120 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,904 parts In-Stock

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SupplyDigital Components

Austria . 5,068 parts In-Stock

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Microchip USA

USA . 5,067 parts In-Stock

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Authorized Procurement Solutions

USA . 2,700 parts In-Stock

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Kulean Microsystems

USA . 2,477 parts In-Stock

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Kepictronics

USA . 2,229 parts In-Stock

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Metaverse IC Inc.

Canada . 2,214 parts In-Stock

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Assy Fe

Spain . 2,214 parts In-Stock

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Problanco Electronics

Mexico . 2,118 parts In-Stock

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Corphita

USA . 966 parts In-Stock

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UHIMA Technologies

Türkiye . 881 parts In-Stock

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Corohmni

South Africa . 134 parts In-Stock

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Overview

Experience the superior quality and performance of the NCP5371MNR2G by Onsemi. With a reputation for excellence in power management integrated circuits, Onsemi delivers reliable solutions for processor applications. This specialized PMIC offers a current supply of 10mA and a voltage supply range of 4.5V to 5.5V, ensuring optimal efficiency. The NCP5371MNR2G, packaged in Tape & Reel (TR) format, is designed for surface mount installation, making it easy to integrate into your project. Trust Onsemi's expertise and unlock the potential of your power management needs with the NCP5371MNR2G.

Feature Benefit Bullets

Standard Package: 2,500

Buying in bulk quantities of 2,500 units can potentially save costs for large-scale manufacturing or projects.

Category: Integrated Circuits (ICs) Power Management (PMIC) Power Management - Specialized

This product is specifically designed for power management applications, ensuring efficient and reliable power delivery.

Package: Tape & Reel (TR)

The tape and reel packaging simplifies the assembly process, making it easier to pick and place components during manufacturing.

Current - Supply: 10mA

Low current consumption of 10mA helps in reducing power consumption and increasing overall efficiency.

Voltage - Supply: 4.5V ~ 5.5V

The wide voltage supply range of 4.5V to 5.5V makes this product versatile and compatible with different power sources.

Operating Temperature: -40 °C ~ 85°C

The wide operating temperature range allows this product to function effectively in various environmental conditions, from extreme cold to moderate heat.

Mounting Type: Surface Mount

Surface mount technology enables easy and secure attachment of the component to the PCB, saving space and facilitating automated assembly processes.

Package / Case: 48-VFQFN Exposed Pad

The 48-VFQFN package with exposed pad design improves thermal dissipation and helps in maintaining the component's temperature within safe limits.

Supplier Device Package: 48-QFN (7x7)

The 48-QFN package with a dimension of 7x7mm provides a compact form factor suitable for space-constrained designs.

Base Product Number: NCP5371

The NCP5371 base product number is a recognized industry standard, ensuring compatibility and interoperability with other components and systems.

Moisture Sensitivity Level (MSL): 1 (Unlimited)

The MSL level 1 indicates that this component has unlimited shelf life and can be stored without requiring special handling precautions related to moisture exposure.

Technical Specifications

Additional Parts NCP5371MNR2G attributes and parameters. Explore more Additional Parts devices from Onsemi

Technical Specifications

Operating Temperature:

-40°C ~ 85°C

Category:

Integrated Circuits (ICs)
Power Management (PMIC) Power Management - Specialized

Applications:

Processor

Package / Case:

48-VFQFN Exposed Pad

Voltage - Supply:

4.5V ~ 5.5V

Package:

Tape & Reel (TR)

Current - Supply:

10mA

Mounting Type:

Surface Mount

Supplier Device Package:

48-QFN (7x7)

Standard Package:

2,500

Base Product Number:

NCP5371

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

NCP5371MNR2G Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8542.39.0001

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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