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NCP4623HSNADJT1G

Onsemi

NCP4623HSNADJT1G by Onsemi

NCP4623HSNADJT1G by Onsemi is an adjustable positive single output LDO regulator with a max output voltage of 24V and a max dropout voltage of 0.4V. It operates in temperatures ranging from -40 to 150 °C, making it suitable for various applications requiring precise voltage regulation in compact spaces.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Chip Stock

USA . 6,400 parts In-Stock

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Vyrian

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Digiode

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AZTECH Wire

Italy . 75 parts In-Stock

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$10.300

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Component Stockers USA

USA . 330 parts In-Stock

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$99.990

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Problanco Electronics

Mexico . 7,937 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,797 parts In-Stock

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Kulean Microsystems

USA . 6,257 parts In-Stock

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TANS Electronics

Latvia . 5,185 parts In-Stock

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Perfect Parts

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Authorized Procurement Solutions

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Corphita

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SupplyDigital Components

Austria . 1,340 parts In-Stock

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Futuretech Components

Singapore . 689 parts In-Stock

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Microchip USA

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Vigor

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UHIMA Technologies

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Overview

Discover the NCP4623HSNADJT1G by Onsemi, an adjustable regulator that offers top-notch quality and reliability. Manufactured by Onsemi, a trusted name in the industry, this product is perfect for a wide range of applications. With its advanced technology and high-performance features, this LDO regulator provides exceptional value and benefits to customers. Experience peace of mind knowing that you are investing in a product that delivers superior performance and efficiency. Elevate your projects with the NCP4623HSNADJT1G and unlock endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good durability and resistance to environmental factors, making this product suitable for various applications.

Maximum Dropout Voltage-1: 1.4 V

Low dropout voltage ensures efficient power conversion and minimal power loss, making it ideal for applications where power efficiency is crucial.

Surface Mount: YES

Surface mount capability simplifies the installation process and allows for compact design layouts, saving space in the application.

Operating Temperature (TJ-Max): 150 °C

High maximum operating temperature tolerance enables this regulator to function reliably in various temperature conditions, ensuring consistent performance.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, enhancing the overall efficiency and performance of the regulator.

Package Shape: RECTANGULAR

Rectangular package shape allows for easy integration into circuit designs and provides stability during installation, ensuring reliable operation.

Terminal Form: GULL WING

Gull wing terminal form simplifies the soldering process, making it easier to mount the regulator onto the circuit board securely.

Operating Temperature (TJ-Min): -40 °C

Wide temperature operating range from -40 °C ensures the regulator can operate in extreme cold environments without any issues.

Adjustability: ADJUSTABLE

Adjustable output voltage allows for flexibility in voltage regulation, catering to a wide range of applications and settings.

Regulator Type: ADJUSTABLE POSITIVE SINGLE OUTPUT LDO REGULATOR

Positive single output LDO regulator provides stable output voltage with low dropout, ensuring consistent and reliable performance in various electronic devices.

Technical Specifications

Adjustable Regulators - Positive Single Output LDO NCP4623HSNADJT1G attributes and parameters. Explore more Adjustable Regulators - Positive Single Output LDO devices from Onsemi

Specs

Adjustability:

ADJUSTABLE

Maximum Dropout Voltage-1:

.4 V

Nominal Dropout Voltage-1:

.2 V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2.9 mm

Maximum Line Regulation (%/V):

.2

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

5

Operating Temperature (TJ-Max):

150 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current-1:

.14 A

Maximum Output Voltage-1:

24 V

Minimum Output Voltage-1:

2.5 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.4 mm

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.65 mm

Trade Compliance

NCP4623HSNADJT1G Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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