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NCP3066MNTXG

Onsemi

NCP3066MNTXG by Onsemi

NCP3066MNTXG by Onsemi is a LED display driver with 8 terminals, operating voltage range of 3-40V, and max supply current of 7mA. It is ideal for graphics displays, featuring a small outline package style suitable for commercial temperature grades up to 85 °C.

Median Price

$1.131

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 3,500 parts In-Stock

1+ parts

$1.450

100+ parts

$1.090

1k+ parts

$0.874

10k+ parts

$0.796

3,500

$1.450

$1.090

$0.874

$0.796

Chip1Stop

Japan . 3,925 parts In-Stock

1+ parts

$5.910

100+ parts

$2.470

1k+ parts

$1.590

10k+ parts

-

3,925

$5.910

$2.470

$1.590

-

Rochester

USA . 5,946 parts In-Stock

1+ parts

-

100+ parts

$1.090

1k+ parts

$0.905

10k+ parts

$0.807

5,946

-

$1.090

$0.905

$0.807

DigiKey

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.862

4,000

-

-

-

$0.862

Verical

USA . 3,980 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.131

10k+ parts

-

3,980

-

-

$1.131

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 264 parts In-Stock

1+ parts

$0.846

100+ parts

-

1k+ parts

-

10k+ parts

-

264

$0.846

-

-

-

Vyrian

USA . 2,112 parts In-Stock

1+ parts

$0.891

100+ parts

-

1k+ parts

-

10k+ parts

-

2,112

$0.891

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 573 parts In-Stock

1+ parts

$0.690

100+ parts

-

1k+ parts

-

10k+ parts

-

573

$0.690

-

-

-

Corphita

USA . 1,821 parts In-Stock

1+ parts

$0.802

100+ parts

-

1k+ parts

-

10k+ parts

-

1,821

$0.802

-

-

-

Component Stockers USA

USA . 7,954 parts In-Stock

1+ parts

$0.870

100+ parts

$0.810

1k+ parts

$0.740

10k+ parts

-

7,954

$0.870

$0.810

$0.740

-

Corohmni

South Africa . 182 parts In-Stock

1+ parts

$0.891

100+ parts

-

1k+ parts

-

10k+ parts

-

182

$0.891

-

-

-

Perfect Parts

USA . 39,698 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

39,698

-

-

-

-

Authorized Procurement Solutions

USA . 7,705 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,705

-

-

-

-

Kulean Microsystems

USA . 4,507 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,507

-

-

-

-

iodParts Technologies Inc.

India . 3,925 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,925

-

-

-

-

SupplyDigital Components

Austria . 2,696 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,696

-

-

-

-

TANS Electronics

Latvia . 1,732 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,732

-

-

-

-

UHIMA Technologies

Türkiye . 797 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

797

-

-

-

-

Problanco Electronics

Mexico . 319 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

319

-

-

-

-

Overview

Enhance your display driver performance with the NCP3066MNTXG from Onsemi. Crafted with precision and expertise, this graphics display driver offers unmatched quality and reliability for a wide range of applications. From LED displays to digital signage, this small outline and heat sink package delivers exceptional value with its wide supply voltage range and commercial-grade temperature grade. Experience seamless operation and superior efficiency with Onsemi's cutting-edge technology, making the NCP3066MNTXG the perfect choice for all your display driver needs. Upgrade your devices today and unlock a world of possibilities with Onsemi's innovative solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material ensures durability and resistance to heat, making this product reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for easy installation and integration into various electronic devices.

Maximum Supply Voltage: 40 V

High maximum supply voltage range provides flexibility in power input options for different applications.

Package Shape: SQUARE

Square package shape allows for efficient use of space on a circuit board, optimizing layout design.

No. of Terminals: 8

Having 8 terminals enables connection to multiple components, enhancing compatibility and functionality.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Small outline, heat sink/slug, and very thin profile package style ensures compactness and efficient heat dissipation.

Minimum Supply Voltage: 3 V

Low minimum supply voltage requirement allows for operation in low power environments, conserving energy.

Maximum Operating Temperature: 85 °C

High maximum operating temperature range ensures reliability and performance in various environmental conditions.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature range enables usage in cold environments without affecting performance.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides corrosion resistance and solderability for secure connections.

Terminal Position: DUAL

Dual terminal position allows for flexibility in PCB layout and connection orientation.

Maximum Seated Height: 1 mm

Low maximum seated height enables compact design and space-saving integration in electronic devices.

Width: 4 mm

Narrow width specification allows for efficient use of board space and layout optimization.

Maximum Time At Peak Reflow Temperature (s): 30

Short maximum time at peak reflow temperature ensures component reliability during soldering process.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability enables secure and stable solder joints.

Length: 4 mm

Compact length dimension ensures space-saving integration in electronic devices and PCB layouts.

Temperature Grade: COMMERCIAL

Commercial temperature grade specification ensures compatibility with standard operating conditions in commercial applications.

Technology: BIPOLAR

Bipolar technology offers high-speed and robust performance for driving LED displays efficiently.

Terminal Form: NO LEAD

No lead terminal form complies with environmental regulations and enables lead-free soldering.

Maximum Supply Current: 7 mA

Low maximum supply current requirement ensures energy efficiency and reduces power consumption.

Nominal Supply Voltage: 5 V

Standard nominal supply voltage specification for compatibility with various electronic systems and power sources.

Terminal Pitch: 0.8 mm

Narrow terminal pitch allows for high-density mounting and compact design of electronic devices.

Interface IC Type: LED DISPLAY DRIVER

Specifically designed as a LED display driver, ensuring optimal performance and compatibility for LED display applications.

Technical Specifications

Graphics Display Drivers NCP3066MNTXG attributes and parameters. Explore more Graphics Display Drivers devices from Onsemi

Specs

Interface IC Type:

JESD-30 Code:

S-PDSO-N8

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.16,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Current:

7 mA

Maximum Supply Voltage:

40 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

NCP3066MNTXG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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