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NCP170BXV330T2G

Onsemi

NCP170BXV330T2G by Onsemi

NCP170BXV330T2G by Onsemi is a fixed positive single output LDO regulator with a nominal output voltage of 3.3 V and max output current of 0.15 A. It features a small outline, very thin profile package style and operates in temperatures ranging from -40 to 85 °C. Ideal for applications requiring precise voltage regulation in compact electronic devices.

Median Price

$0.165

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 8,000 parts In-Stock

1+ parts

$0.165

100+ parts

$0.155

1k+ parts

$0.140

10k+ parts

-

8,000

$0.165

$0.155

$0.140

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,193 parts In-Stock

1+ parts

$0.157

100+ parts

-

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2,193

$0.157

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Flip Electronics

USA . 23,600 parts In-Stock

1+ parts

-

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23,600

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Vyrian

USA . 3,379 parts In-Stock

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3,379

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,218 parts In-Stock

1+ parts

$0.148

100+ parts

-

1k+ parts

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10k+ parts

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1,218

$0.148

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-

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Vigor

Singapore . 910 parts In-Stock

1+ parts

$0.150

100+ parts

-

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910

$0.150

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-

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Corohmni

South Africa . 156 parts In-Stock

1+ parts

$0.165

100+ parts

-

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156

$0.165

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AZTECH Wire

Italy . 915 parts In-Stock

1+ parts

$13.930

100+ parts

-

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915

$13.930

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Component Stockers USA

USA . 758 parts In-Stock

1+ parts

$99.990

100+ parts

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758

$99.990

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10,000

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TANS Electronics

Latvia . 4,888 parts In-Stock

1+ parts

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4,888

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Problanco Electronics

Mexico . 3,529 parts In-Stock

1+ parts

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3,529

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UHIMA Technologies

Türkiye . 917 parts In-Stock

1+ parts

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917

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Kulean Microsystems

USA . 819 parts In-Stock

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819

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Microchip USA

USA . 294 parts In-Stock

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294

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SupplyDigital Components

Austria . 145 parts In-Stock

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145

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Overview

Discover the NCP170BXV330T2G by Onsemi, a high-quality Fixed Positive Single Output LDO Regulator that guarantees reliable performance and precise output voltage for your electronic applications. With Onsemi's trusted manufacturing expertise, this regulator ensures stability and efficiency, making it ideal for a wide range of devices. Experience the value and benefits of this compact and versatile product, offering a maximum output current of 0.15 A and a maximum load regulation of 0.02%. Elevate your projects with the NCP170BXV330T2G and enjoy seamless operation and top-notch quality every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protects the internal components, ensuring a long-lasting and reliable product.

Maximum Dropout Voltage-1: 1.25 V

Low dropout voltage ensures efficient power conversion and minimizes heat dissipation.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving space and enabling automated assembly.

Operating Temperature (TJ-Max): 85 °C

Wide operating temperature range makes this regulator suitable for various environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high efficiency, making this regulator energy-efficient.

Package Shape: RECTANGULAR

Rectangular shape is space-efficient and fits well in compact electronic devices.

Terminal Form: FLAT

Flat terminals ensure easy soldering and secure connections.

Operating Temperature (TJ-Min): -40 °C

Can operate in low-temperature environments without performance issues.

Minimum Output Voltage-1: 3.234 V

Provides a stable and accurate output voltage for connected devices.

Maximum Voltage Tolerance: 2 %

Ensures precise voltage regulation, preventing damage to sensitive components.

Nominal Output Voltage-1: 3.3 V

Stable output voltage suitable for powering various electronic components and circuits.

No. of Terminals: 6

Sufficient number of terminals for easy integration into circuit designs.

Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE

Compact and slim design for space-saving and sleek applications.

Terminal Pitch: 0.5 mm

Fine pitch allows for close spacing on circuit boards, enabling high-density layouts.

Regulator Type: FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

Specific type of regulator designed for stable and precise voltage regulation in various applications.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin finish provides good conductivity and solderability for reliable connections.

Terminal Position: DUAL

Dual terminal position provides flexibility in circuit board layout and connection options.

Maximum Output Voltage-1: 3.366 V

Maintains voltage within a narrow range, ensuring consistent performance of connected devices.

Maximum Seated Height: 0.6 mm

Low-profile design suitable for compact electronic devices with height restrictions.

Width: 1.2 mm

Narrow width allows for placement in tight spaces on circuit boards.

Maximum Load Regulation: 0.02 %

Precise load regulation ensures stable output voltage under varying load conditions.

Minimum Input Voltage: 4.3 V

Wide input voltage range accommodates various power sources for flexibility in applications.

Maximum Output Current-1: 0.15 A

Sufficient output current for powering small electronic devices and circuits.

Nominal Dropout Voltage-1: 0.18 V

Low dropout voltage minimizes power loss and improves efficiency.

Length: 1.6 mm

Compact length for space-efficient integration into electronic designs.

Maximum Input Voltage: 5.5 V

Wide input voltage range allows compatibility with various power sources and applications.

Technical Specifications

Fixed Regulators - Positive Single Output LDO NCP170BXV330T2G attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Onsemi

Specs

Maximum Dropout Voltage-1:

.25 V

Nominal Dropout Voltage-1:

.18 V

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

4.3 V

JESD-30 Code:

R-PDSO-F6

JESD-609 Code:

e3

Length:

1.6 mm

Maximum Load Regulation:

.02 %

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Operating Temperature (TJ-Max):

85 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.15 A

Maximum Output Voltage-1:

3.366 V

Minimum Output Voltage-1:

3.234 V

Nominal Output Voltage-1:

3.3 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

.6 mm

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Voltage Tolerance:

2 %

Width:

1.2 mm

Trade Compliance

NCP170BXV330T2G Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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