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NCP163AMX285TBG

Onsemi

NCP163AMX285TBG by Onsemi

NCP163AMX285TBG by Onsemi is a Fixed Positive Single Output LDO Regulator with an output voltage of 2.85V and max current of 0.25A. It operates in temperatures ranging from -40 to 150 °C, making it suitable for various applications requiring stable voltage regulation in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,163 parts In-Stock

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6,163

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Flip Electronics

USA . 3,000 parts In-Stock

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3,000

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Digiode

USA . 463 parts In-Stock

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463

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AZTECH Wire

Italy . 361 parts In-Stock

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$15.350

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361

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Perfect Parts

USA . 23,744 parts In-Stock

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23,744

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QUARKTWIN TECHNOLOGY LTD

USA . 21,715 parts In-Stock

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21,715

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Kulean Microsystems

USA . 7,920 parts In-Stock

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Problanco Electronics

Mexico . 5,799 parts In-Stock

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Microchip USA

USA . 5,408 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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GreenTree Electronics

Israel . 2,990 parts In-Stock

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2,990

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UHIMA Technologies

Türkiye . 842 parts In-Stock

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842

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SupplyDigital Components

Austria . 784 parts In-Stock

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TANS Electronics

Latvia . 449 parts In-Stock

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Corphita

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Corohmni

South Africa . 187 parts In-Stock

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Overview

Experience the superior performance and reliability of the NCP163AMX285TBG by Onsemi, a leading manufacturer of electronic components. This fixed regulator offers precise voltage output, making it ideal for a wide range of applications. With its compact design and high-quality materials, this LDO provides stable power supply with minimal dropout voltage. Trust Onsemi to deliver cutting-edge technology and unmatched value in every product, ensuring efficiency and longevity for your projects. Elevate your designs with the NCP163AMX285TBG and enjoy the peace of mind that comes with top-notch quality and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability for long-lasting performance.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, saving space and making assembly more efficient.

Operating Temperature (TJ-Max): 150 °C

High maximum operating temperature ensures stability and performance in various environmental conditions.

Package Shape: SQUARE

Square shape enables compact design and efficient use of space on the PCB.

Terminal Form: NO LEAD

No lead terminals reduce risk of short circuits and are more environmentally friendly.

Operating Temperature (TJ-Min): -40 °C

Low minimum operating temperature allows for operation in extreme cold conditions.

Packing Method: TR

TR packing method provides convenience in handling and storage of the product.

Minimum Output Voltage-1: 2.793 V

Low minimum output voltage ensures compatibility with a wide range of applications.

Maximum Voltage Tolerance: 3 %

Tight voltage tolerance ensures stable and accurate output voltage for precise regulation.

Nominal Output Voltage-1: 2.85 V

Stable nominal output voltage ensures consistent performance in voltage regulation.

No. of Terminals: 4

4 terminals provide secure connectivity and stability in the circuit.

Package Style: SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Small outline, heat sink/slug, and very thin profile design offer space-saving and efficient heat dissipation capabilities.

Adjustability: FIXED

Fixed adjustability simplifies circuit design and ensures stable output voltage without the need for additional adjustments.

Terminal Pitch: 0.65 mm

Fine terminal pitch allows for precise connection and placement on the PCB.

Regulator Type: FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

Fixed positive single output LDO regulator provides stable and reliable voltage regulation for various electronic devices.

Terminal Finish: Nickel/Gold/Palladium (Ni/Au/Pd)

Nickel/gold/palladium terminal finish ensures good conductivity and resistance to corrosion for long-term reliability.

Terminal Position: DUAL

Dual terminal position provides redundancy and improved connectivity for enhanced reliability.

Maximum Output Voltage-1: 2.907 V

High maximum output voltage ensures compatibility with a wide range of applications requiring higher voltage levels.

Maximum Seated Height: 0.43 mm

Low maximum seated height allows for compact and space-saving design in tight spaces.

Width: 1 mm

Narrow width enables compact integration onto PCBs and efficient use of space.

Minimum Input Voltage: 3.85 V

Low minimum input voltage requirement ensures compatibility with various power sources.

Maximum Output Current-1: 0.25 A

High maximum output current capability supports a wide range of applications requiring higher current loads.

Nominal Dropout Voltage-1: 1 V

Low nominal dropout voltage minimizes power dissipation and improves efficiency in voltage regulation.

Length: 1 mm

Short length allows for space-saving design and efficient use of PCB real estate.

Maximum Input Voltage: 5.5 V

High maximum input voltage rating ensures compatibility with various power sources.

Maximum Input Voltage Absolute: 6 V

Even higher absolute maximum input voltage rating ensures robustness and resilience against voltage spikes or transients.

Technical Specifications

Fixed Regulators - Positive Single Output LDO NCP163AMX285TBG attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Onsemi

Specs

Adjustability:

FIXED

Nominal Dropout Voltage-1:

1 V

Maximum Input Voltage Absolute:

6 V

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

3.85 V

JESD-30 Code:

S-PDSO-N4

Length:

1 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

4

Operating Temperature (TJ-Max):

150 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.25 A

Maximum Output Voltage-1:

2.907 V

Minimum Output Voltage-1:

2.793 V

Nominal Output Voltage-1:

2.85 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC4,.04,25

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

.43 mm

Surface Mount:

YES

Terminal Finish:

Nickel/Gold/Palladium (Ni/Au/Pd)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Voltage Tolerance:

3 %

Width:

1 mm

Trade Compliance

NCP163AMX285TBG Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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