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NCP161BFCT450T2G

Onsemi

NCP161BFCT450T2G by Onsemi

NCP161BFCT450T2G by Onsemi is a Fixed Positive Single Output LDO Regulator with 4.5V Nominal Output Voltage, 0.45A Max Output Current, and 0.21V Max Dropout Voltage. It is ideal for applications requiring stable voltage regulation in compact electronic devices due to its small form factor and low dropout voltage.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,309 parts In-Stock

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Digiode

USA . 795 parts In-Stock

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795

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Distributors (Availability)

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Vigor

Singapore . 602 parts In-Stock

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$0.080

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602

$0.080

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AZTECH Wire

Italy . 1,020 parts In-Stock

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$16.560

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Perfect Parts

USA . 28,560 parts In-Stock

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Kulean Microsystems

USA . 8,285 parts In-Stock

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Kepictronics

USA . 8,000 parts In-Stock

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TANS Electronics

Latvia . 3,723 parts In-Stock

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Corphita

USA . 2,050 parts In-Stock

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SupplyDigital Components

Austria . 1,130 parts In-Stock

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Problanco Electronics

Mexico . 888 parts In-Stock

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Corohmni

South Africa . 418 parts In-Stock

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Microchip USA

USA . 298 parts In-Stock

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UHIMA Technologies

Türkiye . 153 parts In-Stock

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Overview

Experience superior quality and reliability with the NCP161BFCT450T2G by Onsemi, a leading manufacturer in the industry. This Fixed Regulator offers a stable output voltage of 4.5V with minimal dropout voltage, ensuring optimal performance in various applications. Its compact design and surface mount capability make it ideal for space-constrained projects. Trust Onsemi to deliver exceptional value and efficiency with the NCP161BFCT450T2G, providing customers with a reliable solution for their power regulation needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and heat resistance for reliable performance in various environments.

Maximum Dropout Voltage-1: 0.21 V

Ensures minimal voltage drop across the regulator, resulting in efficient power conversion.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving space and simplifying assembly.

Operating Temperature (TJ-Max): 125 °C

Can operate under higher temperature conditions, making it suitable for a wide range of applications.

Package Shape: SQUARE

Offers a compact form factor that helps in space-constrained designs.

Regulator Type: FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

Provides a constant output voltage with low dropout, ensuring stability and reliability in power supply.

Maximum Output Current-1: 0.45 A

Capable of delivering sufficient current for various electronic devices and circuits.

Nominal Output Voltage-1: 4.5 V

Delivers a stable output voltage, suitable for powering most electronic components.

Technical Specifications

Fixed Regulators - Positive Single Output LDO NCP161BFCT450T2G attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Onsemi

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.21 V

Nominal Dropout Voltage-1:

.12 V

Maximum Input Voltage Absolute:

6 V

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

5.5 V

JESD-30 Code:

S-PBGA-B4

Length:

.64 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

4

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.45 A

Maximum Output Voltage-1:

4.59 V

Minimum Output Voltage-1:

4.41 V

Nominal Output Voltage-1:

4.5 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA4,2X2,14

Package Shape:

SQUARE

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Qualification Status:

Not Qualified

Maximum Seated Height:

.33 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.35 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Voltage Tolerance:

2 %

Width:

.64 mm

Trade Compliance

NCP161BFCT450T2G Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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