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NCP161AFCTC350T2G

Onsemi

NCP161AFCTC350T2G by Onsemi

NCP161AFCTC350T2G by Onsemi is a fixed positive single output LDO regulator with a nominal output voltage of 3.5V and max output current of 0.45A. It operates in temperatures ranging from -40 to 125 °C, making it suitable for various applications requiring stable voltage regulation in compact electronic devices. The package style is grid array with very thin profile and fine pitch, ideal for space-constrained designs that demand efficient power management solutions.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 3,377 parts In-Stock

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Digiode

USA . 1,113 parts In-Stock

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Microchip USA

USA . 7,093 parts In-Stock

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$0.618

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$0.618

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AZTECH Wire

Italy . 208 parts In-Stock

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$14.970

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Kulean Microsystems

USA . 6,555 parts In-Stock

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Problanco Electronics

Mexico . 5,281 parts In-Stock

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TANS Electronics

Latvia . 3,903 parts In-Stock

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SupplyDigital Components

Austria . 3,292 parts In-Stock

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Corphita

USA . 1,559 parts In-Stock

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Corohmni

South Africa . 452 parts In-Stock

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UHIMA Technologies

Türkiye . 394 parts In-Stock

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Overview

Experience seamless power regulation like never before with the NCP161AFCTC350T2G by Onsemi. Crafted with precision and quality in mind, this fixed positive single output LDO regulator offers unparalleled performance and reliability. Perfect for a wide range of applications, this regulator ensures stable and efficient power delivery, making it ideal for your next project. Trust Onsemi's expertise and innovation to provide you with the best value and benefits, giving you a competitive edge in today's fast-paced market. Elevate your designs with the NCP161AFCTC350T2G and experience the difference.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material that provides good protection for the internal components of the regulator.

Maximum Dropout Voltage-1: 0.255 V

Low dropout voltage ensures efficient power regulation with minimal power loss.

Surface Mount: YES

Easily mountable on PCBs, making it convenient for integration into electronic devices.

Operating Temperature (TJ-Max): 125 °C

Can operate at high temperatures without compromising performance, suitable for various applications.

Package Shape: SQUARE

Compact design saves space, ideal for small electronic devices.

Terminal Form: BALL

Ball terminals provide reliable electrical connections.

Operating Temperature (TJ-Min): -40 °C

Capable of operating in cold environments without performance degradation.

Minimum Output Voltage-1: 3.43 V

Provides a stable output voltage suitable for powering various components.

Maximum Voltage Tolerance: 2 %

Ensures the output voltage remains within a close range of the desired voltage, improving reliability.

Nominal Output Voltage-1: 3.5 V

Stable output voltage for consistent performance of connected devices.

No. of Terminals: 4

Simplified connection setup for easy integration into circuit designs.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Space-saving design suitable for compact electronic devices.

Adjustability: FIXED

Ensures a set output voltage, eliminating the need for manual adjustments.

Terminal Pitch: 0.35 mm

Close terminal spacing for efficient PCB layout.

Regulator Type: FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

Specifically designed for applications requiring a stable positive output voltage with low dropout.

Terminal Position: BOTTOM

Allows for easy PCB mounting and connection.

Maximum Output Voltage-1: 3.57 V

Provides slightly higher output for devices requiring a higher voltage input.

Maximum Seated Height: 0.33 mm

Low-profile design suitable for slim electronic devices.

Width: 0.64 mm

Compact width for efficient PCB layout.

Minimum Input Voltage: 4.5 V

Supports a wide range of input voltages for versatile applications.

Maximum Output Current-1: 0.45 A

Capable of providing sufficient current for powering various components.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for proper solder reflow during manufacturing.

Peak Reflow Temperature °C: 260

Withstands high-temperature soldering processes.

Nominal Dropout Voltage-1: 0.15 V

Low dropout voltage ensures efficient power regulation with minimal power loss.

Length: 0.64 mm

Compact length for space-saving design.

Maximum Input Voltage: 5.5 V

Supports a wide range of input voltages for versatile applications.

Maximum Input Voltage Absolute: 6 V

Can handle higher input voltages for added versatility.

Technical Specifications

Fixed Regulators - Positive Single Output LDO NCP161AFCTC350T2G attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Onsemi

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.255 V

Nominal Dropout Voltage-1:

.15 V

Maximum Input Voltage Absolute:

6 V

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

4.5 V

JESD-30 Code:

S-PBGA-B4

Length:

.64 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

4

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.45 A

Maximum Output Voltage-1:

3.57 V

Minimum Output Voltage-1:

3.43 V

Nominal Output Voltage-1:

3.5 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA4,2X2,14

Package Shape:

SQUARE

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.33 mm

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.35 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Voltage Tolerance:

2 %

Width:

.64 mm

Trade Compliance

NCP161AFCTC350T2G Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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