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NCP161AFCT450T2G

Onsemi

NCP161AFCT450T2G by Onsemi

NCP161AFCT450T2G by Onsemi is a fixed positive single output LDO regulator with a nominal output voltage of 4.5V and max output current of 0.45A. It operates in an extended temperature range from -40 to 125 °C, making it suitable for applications requiring stable voltage regulation in harsh environments. The package style is grid array with very thin profile and fine pitch, ideal for space-constrained designs where precise power management is crucial.

Median Price

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Lifecycle Status

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3

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1k+

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Flip Electronics

USA . 380,000 parts In-Stock

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380,000

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Vyrian

USA . 5,717 parts In-Stock

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5,717

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Digiode

USA . 970 parts In-Stock

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970

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Vigor

Singapore . 340 parts In-Stock

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$0.080

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340

$0.080

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Microchip USA

USA . 6,860 parts In-Stock

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$0.689

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6,860

$0.689

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AZTECH Wire

Italy . 925 parts In-Stock

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$15.990

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925

$15.990

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Perfect Parts

USA . 28,560 parts In-Stock

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28,560

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Authorized Procurement Solutions

USA . 15,000 parts In-Stock

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15,000

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SupplyDigital Components

Austria . 8,300 parts In-Stock

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Kepictronics

USA . 8,000 parts In-Stock

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Kulean Microsystems

USA . 6,813 parts In-Stock

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Problanco Electronics

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Corphita

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UHIMA Technologies

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Overview

Discover the NCP161AFCT450T2G by Onsemi, a top-quality Fixed Regulator with a multitude of applications. Onsemi is a renowned manufacturer known for their reliability and cutting-edge technology. This regulator offers customers exceptional value with its precision output, stable performance, and compact design. Perfect for use in various electronic devices, this product ensures efficient power management with minimal dropout voltage. Experience the difference with Onsemi's NCP161AFCT450T2G - your go-to solution for reliable power regulation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material is lightweight and durable, making the product suitable for various applications.

Maximum Dropout Voltage-1: 0.21 V

Low dropout voltage ensures efficient power regulation and minimal power loss in the system.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on PCBs, saving valuable space.

Operating Temperature (TJ-Max): 125 °C

High maximum operating temperature range ensures reliable performance even in elevated temperature conditions.

Package Shape: SQUARE

Square package shape provides stability and ease of mounting during PCB assembly.

Terminal Form: BALL

Ball terminal form offers reliable electrical connections and facilitates soldering during installation.

Operating Temperature (TJ-Min): -40 °C

Low minimum operating temperature range allows for operation in extreme cold environments.

Minimum Output Voltage-1: 4.41 V

Stable minimum output voltage ensures consistent power supply to connected components.

Maximum Voltage Tolerance: 2 %

Low voltage tolerance ensures accurate output voltage regulation for precise applications.

Nominal Output Voltage-1: 4.5 V

Stable nominal output voltage provides a reliable power source for various electronic devices.

No. of Terminals: 4

Having 4 terminals allows for proper connection to the circuit and ensures stable operation of the regulator.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Unique package style with grid array and thin profile offers compact design and efficient heat dissipation.

Adjustability: FIXED

Fixed adjustability simplifies the design process and eliminates the need for external adjustments, ensuring hassle-free operation.

Terminal Pitch: 0.35 mm

Close terminal pitch allows for compact integration on the PCB and saves space in the overall system design.

Regulator Type: FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

Being a fixed positive single output LDO regulator, it delivers stable output voltage without the need for additional components.

Terminal Position: BOTTOM

Bottom terminal position enables easy and secure mounting on the PCB for reliable electrical connections.

Maximum Output Voltage-1: 4.59 V

High maximum output voltage ensures compatibility with a wide range of applications requiring higher voltage levels.

Maximum Seated Height: 0.33 mm

Low maximum seated height allows for compact installation in space-constrained designs.

Width: 0.64 mm

Narrow width facilitates easy placement on the PCB and saves space in the system layout.

Minimum Input Voltage: 5.5 V

Low minimum input voltage requirement enables compatibility with a wide range of power sources.

Maximum Output Current-1: 0.45 A

High maximum output current enables the regulator to power multiple components or higher power devices with ease.

Maximum Time At Peak Reflow Temperature (s): 30

Provides sufficient time at peak reflow temperature for proper soldering and mounting on the PCB during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures reliability during the soldering process for robust connections.

Nominal Dropout Voltage-1: 0.12 V

Low nominal dropout voltage ensures efficient power regulation and minimal voltage drop across the regulator.

Length: 0.64 mm

Compact length allows for space-saving installation in tightly packed PCB layouts.

Maximum Input Voltage: 5.5 V

Low maximum input voltage requirement ensures compatibility with a wide range of power sources for flexibility in design.

Maximum Input Voltage Absolute: 6 V

Having a high maximum input voltage absolute ensures protection against voltage spikes and transient events, enhancing the regulator's durability.

Technical Specifications

Fixed Regulators - Positive Single Output LDO NCP161AFCT450T2G attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Onsemi

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.21 V

Nominal Dropout Voltage-1:

.12 V

Maximum Input Voltage Absolute:

6 V

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

5.5 V

JESD-30 Code:

S-PBGA-B4

Length:

.64 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

4

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.45 A

Maximum Output Voltage-1:

4.59 V

Minimum Output Voltage-1:

4.41 V

Nominal Output Voltage-1:

4.5 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA4,2X2,14

Package Shape:

SQUARE

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Qualification Status:

Not Qualified

Maximum Seated Height:

.33 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.35 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Voltage Tolerance:

2 %

Width:

.64 mm

Trade Compliance

NCP161AFCT450T2G Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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