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NCP1117DT12

Onsemi

NCP1117DT12 by Onsemi

NCP1117DT12 by Onsemi is a fixed positive single output LDO regulator with a nominal output voltage of 12V and max output current of 1A. It has a max dropout voltage of 1.2V, making it suitable for applications requiring stable voltage regulation in a compact form factor. With surface mount capability and operating temperature range from -55 °C to 150°C, it is ideal for various electronic devices where space and thermal management are critical.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,841 parts In-Stock

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J2 Sourcing AB

Sweden . 2,320 parts In-Stock

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Digiode

USA . 2,239 parts In-Stock

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Pegasus Components GmbH

Germany . 20 parts In-Stock

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Vigor

Singapore . 155 parts In-Stock

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$0.180

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155

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AZTECH Wire

Italy . 353 parts In-Stock

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$8.050

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Component Stockers USA

USA . 248 parts In-Stock

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$99.990

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SupplyDigital Components

Austria . 6,214 parts In-Stock

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Kulean Microsystems

USA . 3,256 parts In-Stock

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TANS Electronics

Latvia . 2,587 parts In-Stock

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Corphita

USA . 1,711 parts In-Stock

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Problanco Electronics

Mexico . 524 parts In-Stock

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UHIMA Technologies

Türkiye . 520 parts In-Stock

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Corohmni

South Africa . 497 parts In-Stock

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Microchip USA

USA . 275 parts In-Stock

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Overview

Elevate your electronic designs with the NCP1117DT12 from Onsemi. Known for their superior quality and reliability, Onsemi's fixed regulators offer precision and stability in powering your devices. Whether you're working on consumer electronics, industrial equipment, or automotive applications, this LDO regulator provides a steady 12V output with minimal dropout voltage. Trust Onsemi to deliver top-notch performance and efficiency, making your projects shine brighter with every use. Choose the NCP1117DT12 for unmatched value and excellence in power management solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and reliability for the product, making it long-lasting.

Maximum Dropout Voltage-1: 1.2 V

This low dropout voltage ensures minimal power loss, making the regulator highly efficient.

Surface Mount: YES

Being surface mountable makes installation easier and more convenient, especially in compact designs.

Operating Temperature (TJ-Max): 150 °C

With a high maximum operating temperature, this regulator can withstand harsh environmental conditions.

Technology: BIPOLAR

The bipolar technology used in this regulator ensures stable output voltage and reliable performance.

Nominal Output Voltage-1: 12 V

A stable output voltage of 12V makes this regulator suitable for a wide range of electronic applications.

Maximum Output Current-1: 1 A

With a maximum output current of 1A, this regulator can power a variety of low-power devices efficiently.

Technical Specifications

Fixed Regulators - Positive Single Output LDO NCP1117DT12 attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Onsemi

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

1.2 V

Nominal Dropout Voltage-1:

1.07 V

Maximum Input Voltage Absolute:

Maximum Input Voltage:

20 V

Minimum Input Voltage:

13.5 V

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e0

Length:

6.54 mm

Maximum Line Regulation:

.0075 %

Maximum Load Regulation:

.028 %

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

2

Operating Temperature (TJ-Max):

150 Cel

Operating Temperature (TJ-Min):

-55 Cel

Maximum Output Current-1:

1 A

Maximum Output Voltage-1:

12.24 V

Minimum Output Voltage-1:

11.76 V

Nominal Output Voltage-1:

12 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SMSIP3H,.38,90TB

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

235

Qualification Status:

Not Qualified

Maximum Seated Height:

2.38 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.29 mm

Terminal Position:

SINGLE

Maximum Voltage Tolerance:

2 %

Width:

6.095 mm

Trade Compliance

NCP1117DT12 Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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