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NBSG86ABAEVB

Onsemi

NBSG86ABAEVB by Onsemi

NBSG86ABAEVB by Onsemi is a Logic Evaluation Board for the NBSG86A IC. It comes in Bulk packaging with MSL of 3. Ideal for testing and demonstrating logic applications, this board includes necessary components for evaluation purposes.

Median Price

$524.850

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 2 parts In-Stock

1+ parts

-

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2

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Distributors (In-Stock)

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Rapid Electronics

USA . 2 parts In-Stock

1+ parts

$524.850

100+ parts

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2

$524.850

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Vyrian

USA . 2,661 parts In-Stock

1+ parts

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2,661

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Digiode

USA . 1,309 parts In-Stock

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1,309

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 805 parts In-Stock

1+ parts

$17.450

100+ parts

-

1k+ parts

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805

$17.450

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Corohmni

South Africa . 351 parts In-Stock

1+ parts

$524.850

100+ parts

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351

$524.850

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TANS Electronics

Latvia . 6,177 parts In-Stock

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6,177

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SupplyDigital Components

Austria . 2,611 parts In-Stock

1+ parts

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2,611

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Kulean Microsystems

USA . 2,247 parts In-Stock

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2,247

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Problanco Electronics

Mexico . 1,090 parts In-Stock

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1,090

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Corphita

USA . 425 parts In-Stock

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425

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UHIMA Technologies

Türkiye . 174 parts In-Stock

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174

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Overview

Discover the next level of innovation with the NBSG86ABAEVB by Onsemi. This cutting-edge development board offers unparalleled quality and reliability, backed by the renowned manufacturer, Onsemi. Ideal for a wide range of applications in the electronics industry, this board provides seamless integration and superior performance. Unlock endless possibilities and streamline your projects with the NBSG86ABAEVB, offering unmatched value and benefits to customers looking to stay ahead in today's competitive market.

Feature Benefit Bullets

Other Names: NBSG86ABAEVBOS; NBSG86ABAEVB-ND; 2266-NBSG86ABAEVB

These various names make it easy to identify and locate the product when searching for it online or in a catalog.

Category: Development Boards, Kits, Programmers; Evaluation Boards; Evaluation and Demonstration Boards and Kits

These categories indicate that the product is versatile and can be used for development, evaluation, and demonstration purposes.

Package: Bulk

The bulk packaging allows for cost-effective purchasing of multiple units at once, making it ideal for larger projects or for stocking up on spares.

Type: Logic

Being a logic type product means it is designed for digital circuitry applications, providing reliable and precise logical operation.

Utilized IC / Part: NBSG86A

The use of the NBSG86A integrated circuit ensures compatibility and optimized performance within the product's design.

Supplied Contents: Board(s)

The inclusion of board(s) in the package means that the product is ready for immediate use or integration into a larger system.

Base Product Number: NBSG86

This base product number helps in identifying the product series or family, making it easier to find related products or accessories if needed.

Moisture Sensitivity Level (MSL): 3 (168 Hours)

The MSL level indicates the product's tolerance to moisture, allowing for safe storage and handling under normal environmental conditions.

Technical Specifications

Additional Parts NBSG86ABAEVB attributes and parameters. Explore more Additional Parts devices from Onsemi

Technical Specifications

Other Names:

NBSG86ABAEVBOS
NBSG86ABAEVB-ND
2266-NBSG86ABAEVB

Type:

Logic

Category:

Development Boards, Kits, Programmers
Evaluation Boards Evaluation and Demonstration Boards and Kits

Supplied Contents:

Board(s)

Utilized IC / Part:

NBSG86A

Package:

Bulk

Embedded:

No

Standard Package:

1

Base Product Number:

NBSG86

Moisture Sensitivity Level (MSL):

3 (168 Hours)

Trade Compliance

NBSG86ABAEVB Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

9030.82.0000

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.