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NBSG53ABAEVB

Onsemi

NBSG53ABAEVB by Onsemi

NBSG53ABAEVB by Onsemi is a Logic Evaluation Board for the NBSG53A IC. It comes in Bulk packaging with Moisture Sensitivity Level of 3. Ideal for testing and demonstrating logic applications, this board includes necessary components for evaluation purposes.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,072 parts In-Stock

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2,072

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Digiode

USA . 1,732 parts In-Stock

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1,732

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 1,050 parts In-Stock

1+ parts

$16.320

100+ parts

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1,050

$16.320

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Problanco Electronics

Mexico . 7,430 parts In-Stock

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7,430

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Kulean Microsystems

USA . 4,263 parts In-Stock

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4,263

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Advanced Electronics

New Zealand . 2,328 parts In-Stock

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2,328

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SupplyDigital Components

Austria . 1,995 parts In-Stock

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1,995

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TANS Electronics

Latvia . 1,904 parts In-Stock

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1,904

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UHIMA Technologies

Türkiye . 790 parts In-Stock

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790

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Corphita

USA . 667 parts In-Stock

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667

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Corohmni

South Africa . 440 parts In-Stock

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440

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Overview

Enhance your projects with the NBSG53ABAEVB evaluation board from Onsemi. Designed with precision and reliability in mind, this Logic type board offers endless possibilities for development and experimentation. Whether you're a seasoned engineer or just starting out, this board provides a user-friendly platform to explore the capabilities of the NBSG53A IC. With Onsemi's reputation for excellence in manufacturing, you can trust that this board will deliver top-notch performance. Elevate your creations with the NBSG53ABAEVB and unlock a world of innovation today.

Feature Benefit Bullets

Other Names: NBSG53ABAEVB-ND

Unique part number for easy identification and procurement.

Category: Development Boards, Kits, Programmers; Evaluation Boards

Versatile usage for development and evaluation purposes.

Package: Bulk

Cost-effective packaging option for bulk purchases.

Type: Logic

Specifically designed for logic applications.

Utilized IC / Part: NBSG53A

Utilizes the NBSG53A IC/part for high-quality performance.

Supplied Contents: Board(s)

Provides necessary board(s) for immediate use.

Base Product Number: NBSG53

Belongs to a series of products for compatibility and expansion options.

Moisture Sensitivity Level (MSL): 3 (168 Hours)

Ensures safe handling and storage of the product to maintain quality.

Technical Specifications

Additional Parts NBSG53ABAEVB attributes and parameters. Explore more Additional Parts devices from Onsemi

Technical Specifications

Other Names:

NBSG53ABAEVB-ND
NBSG53ABAEVBOS

Type:

Logic

Category:

Development Boards, Kits, Programmers
Evaluation Boards Evaluation and Demonstration Boards and Kits

Supplied Contents:

Board(s)

Utilized IC / Part:

NBSG53A

Package:

Bulk

Standard Package:

1

Base Product Number:

NBSG53

Moisture Sensitivity Level (MSL):

3 (168 Hours)

Trade Compliance

NBSG53ABAEVB Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

9030.82.0000

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Authentic purchasing experiences

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