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NB7VPQ7011MMUTXG

Onsemi

NB7VPQ7011MMUTXG by Onsemi

NB7VPQ7011MMUTXG by Onsemi is a Line Transceiver with 12 terminals, operating at -40 to 85 °C. It features differential outputs, complementary polarity, and requires a supply voltage of 1.7-1.9 V. This chip carrier is ideal for industrial applications requiring precise signal transmission in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,068 parts In-Stock

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Digiode

USA . 1,817 parts In-Stock

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Kulean Microsystems

USA . 8,240 parts In-Stock

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SupplyDigital Components

Austria . 8,021 parts In-Stock

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Problanco Electronics

Mexico . 7,876 parts In-Stock

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TANS Electronics

Latvia . 6,765 parts In-Stock

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Corphita

USA . 1,052 parts In-Stock

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UHIMA Technologies

Türkiye . 408 parts In-Stock

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Corohmni

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Overview

Boost your signal transmission with the NB7VPQ7011MMUTXG by Onsemi. Manufactured with precision and expertise, this line driver/receiver offers unmatched quality and reliability. Ideal for a wide range of applications, this chip carrier is perfect for industrial settings where differential output is crucial. With a low supply voltage and high operating temperature, this product ensures optimal performance while maximizing efficiency. Upgrade your systems today with the superior technology of the NB7VPQ7011MMUTXG by Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly on circuit boards, saving time and space.

Maximum Supply Voltage: 1.9 V

Operates at a maximum supply voltage of 1.9V, suitable for low power consumption and compatibility with various systems.

Package Shape: SQUARE

The square package shape facilitates easy placement and alignment on circuit boards, optimizing space utilization.

No. of Terminals: 12

With 12 terminals, this product offers versatile connectivity options for complex circuit designs and configurations.

Minimum Supply Voltage: 1.7 V

The 1.7V minimum supply voltage ensures reliable operation even at low power levels, extending the product's usability range.

Maximum Operating Temperature: 85 °C

Capable of operating at temperatures up to 85 °C, making it suitable for industrial environments with varying heat conditions.

Output Characteristics: DIFFERENTIAL

Differential output ensures high signal quality and noise immunity, improving overall performance and signal integrity.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this product can function reliably in extreme cold environments.

Terminal Position: QUAD

Quad terminal position offers enhanced stability and secure connection, reducing the risk of signal loss or interference.

Maximum Seated Height: 0.55 mm

With a maximum seated height of 0.55mm, this product is slim and compact, suitable for space-constrained applications.

Width: 1.6 mm

The 1.6mm width enables efficient placement on circuit boards and allows for compact design layouts, optimizing space usage.

Output Polarity: COMPLEMENTARY

Complementary output polarity ensures accurate signal transmission and reception, reducing errors and improving data integrity.

Differential Output: YES

Differential output offers improved noise rejection and signal quality, making this product suitable for high-speed data transmission.

Length: 1.6 mm

At a length of 1.6mm, this product is compact and space-saving, ideal for applications where size constraints are a concern.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications, ensuring durability and reliability in harsh operating conditions.

Terminal Form: NO LEAD

No-lead terminal form simplifies the assembly process and reduces the risk of solder joint failures, enhancing product reliability.

Input Characteristics: DIFFERENTIAL

Differential input characteristics improve noise immunity and signal fidelity, making this product suitable for high-performance applications.

Nominal Supply Voltage: 1.8 V

Operates at a nominal supply voltage of 1.8V, offering a balance between power efficiency and performance for various applications.

Terminal Pitch: 0.4 mm

With a terminal pitch of 0.4mm, this product allows for precise and compact connections on circuit boards, enhancing overall reliability.

Interface IC Type: LINE TRANSCEIVER

The interface IC type of Line Transceiver enables seamless communication between different systems, making this product versatile and compatible with various setups.

Technical Specifications

Line Drivers & Receivers NB7VPQ7011MMUTXG attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Differential Output:

YES

Driver No. of Bits:

1

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

JESD-30 Code:

S-PQCC-N12

Length:

1.6 mm

No. of Functions:

1

No. of Terminals:

12

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

DIFFERENTIAL

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC12,.07SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Receiver No. of Bits:

1

Maximum Seated Height:

.55 mm

Maximum Supply Voltage:

1.9 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.6 mm

Trade Compliance

NB7VPQ7011MMUTXG Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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