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NB7V72MMNHTXG

Onsemi

NB7V72MMNHTXG by Onsemi

NB7V72MMNHTXG by Onsemi is a 16-terminal cross point switch with separate output, operating at temperatures from -40 to 85 °C. It features power supplies of 1.8/2.5V and comes in a square chip carrier package for industrial applications requiring multiplexers & switches in a surface-mount configuration.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,189 parts In-Stock

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Vyrian

USA . 1,018 parts In-Stock

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Problanco Electronics

Mexico . 8,148 parts In-Stock

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TANS Electronics

Latvia . 6,386 parts In-Stock

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SupplyDigital Components

Austria . 4,816 parts In-Stock

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Kulean Microsystems

USA . 4,196 parts In-Stock

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UHIMA Technologies

Türkiye . 856 parts In-Stock

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Corphita

USA . 406 parts In-Stock

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Corohmni

South Africa . 405 parts In-Stock

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Overview

Discover the seamless switching capabilities of the NB7V72MMNHTXG by Onsemi, a top-tier manufacturer known for producing high-quality multiplexers & switches. Perfect for industrial applications, this chip carrier package offers separate outputs and quad terminal positions for maximum flexibility. With a wide operating temperature range and lead-free terminals, this product ensures reliability and durability. Elevate your projects with the cutting-edge technology and superior performance of the NB7V72MMNHTXG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Package Shape: SQUARE

A compact and space-saving design that is convenient for placement in various electronic devices.

Power Supplies (V): 1.8/2.5

Provides flexibility in power options, allowing compatibility with different voltage requirements in electronic systems.

No. of Terminals: 16

Sufficient number of terminals for connecting multiple input and output sources, enhancing the product's versatility.

Package Style (Meter): CHIP CARRIER

Offers a reliable and compact packaging format, ideal for applications where space is limited.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, ensuring stable performance even in demanding operating conditions.

Minimum Operating Temperature: -40 °C

Capable of operating in low-temperature environments, making it suitable for a wide range of applications.

Terminal Position: QUAD

Organized terminal layout for easy identification and connection, simplifying the installation process.

Output (V): SEPARATE OUTPUT

Provides separate output channels, allowing for efficient signal routing and management in complex circuit configurations.

Other IC type: CROSS POINT SWITCH

Utilizes cross-point switching technology for efficient signal routing, ensuring minimal signal loss and distortion.

Temperature Grade: INDUSTRIAL

Designed to meet industrial-grade temperature requirements, ensuring reliable operation in harsh environments.

Terminal Form: NO LEAD

Lead-free terminal construction, complying with environmental regulations and promoting sustainability.

Terminal Pitch: 0.5 mm

Fine terminal pitch for precise connections, enabling high-density circuit integration and improved signal transmission.

Technical Specifications

Multiplexers & Switches NB7V72MMNHTXG attributes and parameters. Explore more Multiplexers & Switches devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

S-PQCC-N16

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

1.8/2.5

Qualification:

Not Qualified

Sub-Category:

Multiplexer or Switches

Surface Mount:

YES

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

NB7V72MMNHTXG Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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