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NB7NPQ7041MMUTWG

Onsemi

NB7NPQ7041MMUTWG by Onsemi

NB7NPQ7041MMUTWG by Onsemi is a Line Transceiver IC with 4-bit driver and receiver functions. It operates in industrial temperature range (-40 to 85 °C) with a supply voltage of 3.3V. This surface-mount chip carrier has 34 terminals, differential output, and is suitable for various communication applications.

Median Price

$1.656

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 532 parts In-Stock

1+ parts

$1.519

100+ parts

$1.186

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$1.116

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532

$1.519

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$1.116

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Arrow

USA . 237 parts In-Stock

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$1.913

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$1.792

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$1.792

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DigiKey

USA . 74,000 parts In-Stock

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$1.040

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$1.040

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$1.040

$1.040

Flip Electronics (Authorized)

USA . 74,000 parts In-Stock

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Verical

USA . 237 parts In-Stock

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$1.792

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237

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$1.792

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Distributors (In-Stock)

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Vyrian

USA . 1,434 parts In-Stock

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$1.004

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Digiode

USA . 1,744 parts In-Stock

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$1.016

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Flip Electronics

USA . 71,000 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 1,774 parts In-Stock

1+ parts

$0.963

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1,774

$0.963

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Corohmni

South Africa . 457 parts In-Stock

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$1.004

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457

$1.004

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SupplyDigital Components

Austria . 5,314 parts In-Stock

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Kulean Microsystems

USA . 4,894 parts In-Stock

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Problanco Electronics

Mexico . 4,308 parts In-Stock

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TANS Electronics

Latvia . 3,458 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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UHIMA Technologies

Türkiye . 390 parts In-Stock

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Microchip USA

USA . 349 parts In-Stock

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349

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Overview

Unleash the power of seamless communication with the NB7NPQ7041MMUTWG by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality line drivers & receivers that are perfect for a wide range of applications. With its surface mount capability and advanced features like differential output and industrial temperature grade, this product offers unmatched performance and reliability. Experience the convenience and efficiency this line transceiver brings to your projects. Elevate your communication systems with Onsemi's cutting-edge technology today!

Feature Benefit Bullets

Surface Mount: YES

Enables easy installation onto circuit boards, saving space and making the product more compact.

Maximum Supply Voltage: 3.465 V

Provides a higher maximum supply voltage compared to similar products, allowing for greater flexibility in power requirements.

No. of Functions: 4

Offers multiple functions in a single package, reducing the need for additional components and simplifying circuit design.

Package Shape: RECTANGULAR

The rectangular shape is common and easy to work with, fitting well into standard board layouts.

Maximum Operating Temperature: 85 °C

Can withstand higher temperatures, making it suitable for industrial applications where heat may be a concern.

Technical Specifications

Line Drivers & Receivers NB7NPQ7041MMUTWG attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Differential Output:

YES

Driver No. of Bits:

4

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

JESD-30 Code:

R-XQCC-N34

Length:

4.3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Terminals:

34

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Receiver No. of Bits:

4

Maximum Seated Height:

.4 mm

Maximum Supply Voltage:

3.465 V

Minimum Supply Voltage:

3.135 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.1 mm

Trade Compliance

NB7NPQ7041MMUTWG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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