Loading...

NB6HQ14MMNG

Onsemi

NB6HQ14MMNG by Onsemi

NB6HQ14MMNG clock driver by Onsemi features a propagation delay of 0.275 ns, differential input conditioning, and operates at a temperature range of -40 to 85 °C. It is suitable for applications requiring precise timing synchronization in industrial settings with its square package shape and surface mount capability.

Median Price

$6.725

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 10,740 parts In-Stock

1+ parts

-

100+ parts

$7.220

1k+ parts

-

10k+ parts

-

10,740

-

$7.220

-

-

Rochester

USA . 10,725 parts In-Stock

1+ parts

-

100+ parts

$6.230

1k+ parts

$5.580

10k+ parts

$5.250

10,725

-

$6.230

$5.580

$5.250

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 758 parts In-Stock

1+ parts

$6.593

100+ parts

-

1k+ parts

-

10k+ parts

-

758

$6.593

-

-

-

Vyrian

USA . 667 parts In-Stock

1+ parts

$6.940

100+ parts

-

1k+ parts

-

10k+ parts

-

667

$6.940

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,305 parts In-Stock

1+ parts

$6.246

100+ parts

-

1k+ parts

-

10k+ parts

-

1,305

$6.246

-

-

-

Corohmni

South Africa . 400 parts In-Stock

1+ parts

$6.940

100+ parts

-

1k+ parts

-

10k+ parts

-

400

$6.940

-

-

-

Component Stockers USA

USA . 12,225 parts In-Stock

1+ parts

$7.210

100+ parts

$6.770

1k+ parts

$6.130

10k+ parts

$6.130

12,225

$7.210

$6.770

$6.130

$6.130

Continental Prestige Electronics

USA . 10,750 parts In-Stock

1+ parts

-

100+ parts

$5.740

1k+ parts

-

10k+ parts

-

10,750

-

$5.740

-

-

Kulean Microsystems

USA . 1,729 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,729

-

-

-

-

SupplyDigital Components

Austria . 1,477 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,477

-

-

-

-

UHIMA Technologies

Türkiye . 713 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

713

-

-

-

-

Problanco Electronics

Mexico . 515 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

515

-

-

-

-

Microchip USA

USA . 370 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

370

-

-

-

-

TANS Electronics

Latvia . 354 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

354

-

-

-

-

Overview

Enhance the performance of your electronic devices with the NB6HQ14MMNG clock driver from Onsemi. Designed to deliver ultra-fast propagation delay and precise signal conditioning, this chip carrier offers unparalleled quality and reliability. Ideal for a wide range of applications including data communications and networking equipment, the NB6HQ14MMNG ensures optimal functionality and seamless operation. Trust Onsemi for cutting-edge technology and superior products that provide unmatched value and benefits to customers seeking top-notch performance in their designs. Elevate your projects with the NB6HQ14MMNG clock driver and experience the difference today.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 0.275 ns

Low propagation delay ensures fast and efficient circuit performance.

Surface Mount: YES

Easy to mount on circuit boards, saving space and providing convenience in assembly.

Input Conditioning: DIFFERENTIAL

Differential input conditioning allows for noise reduction and improved signal integrity.

Package Shape: SQUARE

Square package shape helps in uniform heat dissipation and efficient use of space on the circuit board.

Nominal Supply Voltage / Vsup (V): 2.5

Compatible with commonly used supply voltages, making it versatile for various applications.

Power Supplies (V): 1.8/2.5, 2.5

Support for multiple power supplies gives flexibility in design and operation.

No. of Terminals: 16

Sufficient number of terminals for connectivity and control in a circuit.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Multiple package styles offer options for different mounting and cooling requirements.

Minimum Supply Voltage (Vsup): 2.375 V

Can operate at low supply voltages, saving power and suitable for low-power applications.

Temperature Grade: INDUSTRIAL

Industrial-grade components are suitable for harsh operating conditions and extended temperature ranges.

Technical Specifications

Clock Drivers & Buffers NB6HQ14MMNG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

6N

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-XQCC-N16

Length:

3 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

16

No. of True Outputs:

2

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Power Supplies (V):

1.8/2.5,2.5

Propagation Delay At Nominal Supply:

.275 ns

Propagation Delay (tpd):

.275 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.5 ns

Maximum Seated Height:

1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

2.625 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

3 mm

Trade Compliance

NB6HQ14MMNG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 2