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NB4N840MMNTWG

Onsemi

NB4N840MMNTWG by Onsemi

NB4N840MMNTWG by Onsemi is a 32-terminal chip carrier with 2 functions, operating at a supply voltage of 3.3V. With a max temperature of 85 °C, it's ideal for industrial applications requiring fast switch-on/off times (0.135ns) and separate outputs.

Median Price

$9.490

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 41,000 parts In-Stock

1+ parts

-

100+ parts

$6.920

1k+ parts

-

10k+ parts

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41,000

-

$6.920

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Flip Electronics (Authorized)

USA . 41,000 parts In-Stock

1+ parts

-

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41,000

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Rochester

USA . 3,681 parts In-Stock

1+ parts

-

100+ parts

$9.490

1k+ parts

$8.490

10k+ parts

$7.990

3,681

-

$9.490

$8.490

$7.990

Verical

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

$11.863

1k+ parts

$10.613

10k+ parts

-

3,000

-

$11.863

$10.613

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 440 parts In-Stock

1+ parts

$8.770

100+ parts

-

1k+ parts

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440

$8.770

-

-

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Digiode

USA . 1,512 parts In-Stock

1+ parts

$10.042

100+ parts

-

1k+ parts

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1,512

$10.042

-

-

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Flip Electronics

USA . 41,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

-

41,000

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 129 parts In-Stock

1+ parts

$8.770

100+ parts

-

1k+ parts

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129

$8.770

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-

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Corphita

USA . 886 parts In-Stock

1+ parts

$9.513

100+ parts

-

1k+ parts

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10k+ parts

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886

$9.513

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Authorized Procurement Solutions

USA . 20,000 parts In-Stock

1+ parts

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100+ parts

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20,000

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Kulean Microsystems

USA . 6,730 parts In-Stock

1+ parts

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6,730

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TANS Electronics

Latvia . 5,532 parts In-Stock

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5,532

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SupplyDigital Components

Austria . 4,606 parts In-Stock

1+ parts

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4,606

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Continental Prestige Electronics

USA . 3,681 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$8.470

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3,681

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$8.470

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Problanco Electronics

Mexico . 3,431 parts In-Stock

1+ parts

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3,431

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Microchip USA

USA . 2,334 parts In-Stock

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2,334

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UHIMA Technologies

Türkiye . 752 parts In-Stock

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752

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Overview

Enhance your electronic designs with the NB4N840MMNTWG by Onsemi, a top-quality multiplexer & switch that offers reliability and precision. Manufactured by Onsemi, a trusted industry leader, this product is perfect for a wide range of applications. With its advanced features and superior performance, this chip carrier with a very thin profile provides separate outputs and quick switching times, making it ideal for industrial-grade projects. Upgrade your projects today with the NB4N840MMNTWG and experience the value and benefits it brings to your designs.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto PCBs, saving space and reducing manufacturing costs.

No. of Functions: 2

Having 2 functions in one multiplexer or switch provides versatility and flexibility in routing signals.

Nominal Supply Voltage (Vsup): 3.3 V

Operates at a common voltage level, making it compatible with many systems and components.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, suitable for industrial applications where heat may be a concern.

Terminal Finish: MATTE TIN

Matte tin finish offers good conductivity and corrosion resistance for reliable performance over time.

Width (mm): 5 mm

Compact width allows for space-saving installation in tight PCB layouts or crowded electronic enclosures.

No. of Channels: 2

Having 2 channels provides the capability to switch between different signal paths or inputs, enhancing functionality.

Technical Specifications

Multiplexers & Switches NB4N840MMNTWG attributes and parameters. Explore more Multiplexers & Switches devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

2

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Maximum Switch-off Time:

.135 ns

Maximum Switch-on Time:

.135 ns

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

5 mm

Trade Compliance

NB4N840MMNTWG Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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