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NB4N507ADG

Onsemi

NB4N507ADG by Onsemi

NB4N507ADG clock generator by Onsemi operates at a max output frequency of 200MHz with supply voltages of 3.3V/5V. Ideal for industrial applications, it features a small outline package style and CMOS technology, making it suitable for various electronic devices requiring precise clock generation within the temperature range of -40 to 85°C.

Median Price

$5.782

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 46 parts In-Stock

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$7.190

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46

$7.190

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Arrow

USA . 1,728 parts In-Stock

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$5.782

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$4.450

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1,728

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$5.782

$4.450

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Verical

USA . 1,728 parts In-Stock

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$4.962

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$4.335

10k+ parts

$3.819

1,728

-

$4.962

$4.335

$3.819

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$4.872

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10

$4.872

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Digiode

USA . 1,863 parts In-Stock

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$7.002

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1,863

$7.002

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Vyrian

USA . 8,937 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,068 parts In-Stock

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$4.220

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1,068

$4.220

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Corohmni

South Africa . 287 parts In-Stock

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$4.962

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287

$4.962

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Corphita

USA . 2,292 parts In-Stock

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$6.633

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2,292

$6.633

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Microchip USA

USA . 1,603 parts In-Stock

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$21.644

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1,603

$21.644

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iodParts Technologies Inc.

India . 5,808 parts In-Stock

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Lixinc

USA . 4,853 parts In-Stock

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Problanco Electronics

Mexico . 3,494 parts In-Stock

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Kulean Microsystems

USA . 2,367 parts In-Stock

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TANS Electronics

Latvia . 1,441 parts In-Stock

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SupplyDigital Components

Austria . 750 parts In-Stock

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750

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UHIMA Technologies

Türkiye . 609 parts In-Stock

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609

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Perfect Parts

USA . 570 parts In-Stock

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570

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Overview

Discover the innovative NB4N507ADG clock generator by Onsemi, designed to deliver top-notch performance and reliability. With a maximum output clock frequency of 200 MHz and a temperature grade suitable for industrial use, this small outline package offers seamless integration into a wide range of applications. Trust in Onsemi's expertise to provide cutting-edge technology that meets your needs. Experience the value and benefits of precise timing solutions with the NB4N507ADG, ensuring optimal performance and efficiency in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and lightweight, making the product easy to handle and transport.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving space and improving reliability.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this clock generator can handle varying power inputs without risk of damage.

Maximum Output Clock Frequency: 200 MHz

The high maximum output clock frequency allows for fast and accurate timekeeping in electronic devices.

Minimum Operating Temperature: -40 °C

The ability to operate in low temperatures ensures reliable performance in harsh environments.

Nominal Primary Clock/Crystal Frequency: 52 MHz

The nominal primary clock frequency of 52 MHz provides a stable and accurate time base for electronic systems.

Technical Specifications

Clock Generators NB4N507ADG attributes and parameters. Explore more Clock Generators devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Clock Frequency:

200 MHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Nominal Primary Clock/Crystal Frequency:

52 MHz

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Clock Generators

Maximum Supply Current:

35 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Peripheral IC Type:

Trade Compliance

NB4N507ADG Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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