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MOC3162SR2VM

Onsemi

MOC3162SR2VM by Onsemi

MOC3162SR2VM by Onsemi is a single TRIAC output optocoupler with zero cross. It has a max on-state voltage of 3V, peak surge current of 1A, and isolation voltage of 4170V. Ideal for applications requiring optocoupler trigger device outputs in temperatures ranging from -40 °C to 85°C.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 2,557 parts In-Stock

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Digiode

USA . 1,153 parts In-Stock

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Andel Nordic

Denmark . 242 parts In-Stock

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$1.518

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Component Stockers USA

USA . 514 parts In-Stock

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$99.990

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Kulean Microsystems

USA . 8,348 parts In-Stock

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SupplyDigital Components

Austria . 4,694 parts In-Stock

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Corphita

USA . 2,279 parts In-Stock

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Problanco Electronics

Mexico . 1,806 parts In-Stock

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Glotronic Ltd.

UK . 1,800 parts In-Stock

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TANS Electronics

Latvia . 1,405 parts In-Stock

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Supply Digital

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UHIMA Technologies

Türkiye . 320 parts In-Stock

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Corohmni

South Africa . 78 parts In-Stock

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Overview

Elevate your electronic designs with the MOC3162SR2VM by Onsemi. This optocoupler trigger device output is designed for maximum performance and reliability, offering a peak surge current of 1A and a maximum isolation voltage of 4170V. Whether you're working on industrial control systems, motor control applications, or solid-state relays, this product provides unmatched quality and value. Trust Onsemi's expertise in optoelectronics to bring your projects to the next level. Experience the benefits firsthand and see the difference this component can make in your designs.

Feature Benefit Bullets

Maximum On State Voltage: 3 V

Low on state voltage allows for efficient power consumption and reduced heat generation.

Configuration: SINGLE

Single configuration simplifies the wiring and setup process.

Peak Surge Current: 1 A

High peak surge current capability ensures reliable performance under transient conditions.

Maximum Forward Current: 0.06 A

Capable of handling moderate forward current for a variety of applications.

Optoelectronic Type: TRIAC OUTPUT OPTOCOUPLER WITH ZERO CRSVR

Triac output optocoupler with zero cross-over sensing enhances precision in switching applications.

Maximum Operating Temperature: 85 °C

Wide operating temperature range allows for operation in diverse environments.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold conditions.

Maximum Input Trigger Current: 0.01 A

Low input trigger current requirement enables compatibility with a range of control signals.

Repetitive Off-state Voltage (Peak): 600 V

High off-state voltage rating ensures reliable insulation and safety in high voltage environments.

Packing Method: TR

TR packing method provides convenience during storage, handling, and assembly.

Maximum Reverse Leakage Current: 0.0001 A

Low reverse leakage current minimizes energy wastage and improves efficiency.

Minimum Peak Off-state Voltage: 600 V

High peak off-state voltage rating ensures robust performance in off state conditions.

Maximum Isolation Voltage: 4170 V

High isolation voltage offers superior protection against electrical hazards and disturbances.

Mounting Feature: SURFACE MOUNT

Surface mount design facilitates easy and secure installation on PCBs.

Technical Specifications

Optocoupler Trigger Device Outputs MOC3162SR2VM attributes and parameters. Explore more Optocoupler Trigger Device Outputs devices from Onsemi

Specs

Configuration:

SINGLE

Maximum Forward Current:

.06 A

Maximum Input Trigger Current:

.01 A

Maximum Isolation Voltage:

4170 V

Mounting Feature:

No. of Elements:

1

Maximum On State Voltage:

3 V

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Packing Method:

TR

Minimum Peak Off-state Voltage:

600 V

Peak Surge Current:

1 A

Repetitive Off-state Voltage (Peak):

600 V

Maximum Reverse Leakage Current:

.0001 A

Trade Compliance

MOC3162SR2VM Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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