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MOC3071VM

Onsemi

MOC3071VM by Onsemi

The Onsemi MOC3071VM is a single optocoupler with a max on-state voltage of 2.5V and peak surge current of 1A. It operates b/w -40 to 85 °C, with an isolation voltage of 4170V, making it ideal for triggering devices in various applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,091 parts In-Stock

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Vyrian

USA . 538 parts In-Stock

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SupplyDigital Components

Austria . 4,124 parts In-Stock

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Kulean Microsystems

USA . 3,901 parts In-Stock

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TANS Electronics

Latvia . 3,147 parts In-Stock

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Problanco Electronics

Mexico . 1,805 parts In-Stock

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Corphita

USA . 1,052 parts In-Stock

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Corohmni

South Africa . 452 parts In-Stock

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UHIMA Technologies

Türkiye . 337 parts In-Stock

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Overview

Enhance your electronic projects with the reliable MOC3071VM by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality and performance in their optocoupler trigger devices. Whether you're working on industrial automation, power control systems, or lighting applications, this TRIAC output optocoupler offers unparalleled value with its peak surge current of 1A and maximum isolation voltage of 4170V. Trust Onsemi to provide cutting-edge technology that ensures efficiency and reliability in every project.

Feature Benefit Bullets

Maximum On State Voltage: 2.5 V

Low on-state voltage allows for efficient operation and minimal power loss.

Configuration: SINGLE

Simplicity of single configuration makes installation and integration easier.

Peak Surge Current: 1 A

High peak surge current capability provides robust performance in demanding conditions.

Maximum Forward Current: 0.06 A

Suitable for various applications while maintaining efficiency.

Optoelectronic Type: TRIAC OUTPUT OPTOCOUPLER

Provides versatility for controlling AC power systems.

Maximum Operating Temperature: 85 °C

Wide operating temperature range enables reliable performance in different environments.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme cold conditions without issues.

Maximum Input Trigger Current: 0.015 A

Low trigger current required for activation, enhancing efficiency.

Repetitive Off-state Voltage (Peak): 800 V

High off-state voltage tolerance ensures reliability in high voltage applications.

Packing Method: TUBE

Convenient packaging method for storage, handling, and transportation.

Maximum Reverse Leakage Current: 0.0001 A

Negligible reverse leakage current minimizes power loss during operation.

Maximum Isolation Voltage: 4170 V

High isolation voltage ensures safety and protection in electrical circuits.

Mounting Feature: THROUGH HOLE MOUNT

Easy and secure mounting method for quick installation and stability.

Technical Specifications

Optocoupler Trigger Device Outputs MOC3071VM attributes and parameters. Explore more Optocoupler Trigger Device Outputs devices from Onsemi

Specs

Additional Features:

UL APPROVED

Configuration:

SINGLE

Maximum Forward Current:

.06 A

Maximum Input Trigger Current:

.015 A

Maximum Isolation Voltage:

4170 V

Mounting Feature:

No. of Elements:

1

Maximum On State Voltage:

2.5 V

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Optoelectronic Type:

Packing Method:

TUBE

Peak Surge Current:

1 A

Repetitive Off-state Voltage (Peak):

800 V

Maximum Reverse Leakage Current:

.0001 A

Trade Compliance

MOC3071VM Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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