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MMSZ5252ET1

Onsemi

MMSZ5252ET1 by Onsemi

MMSZ5252ET1 by Onsemi is a Zener diode with 24V nominal reference voltage, 5.2mA test current, and 33 ohm dynamic impedance. It is a unidirectional diode in a small outline package suitable for applications requiring precise voltage regulation in temperature range -55 to 150 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,700 parts In-Stock

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Digiode

USA . 2,277 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 687 parts In-Stock

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$18.490

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687

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Component Stockers USA

USA . 519 parts In-Stock

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$99.990

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519

$99.990

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TANS Electronics

Latvia . 7,717 parts In-Stock

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SupplyDigital Components

Austria . 3,539 parts In-Stock

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3,539

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Kulean Microsystems

USA . 2,816 parts In-Stock

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Corphita

USA . 2,403 parts In-Stock

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Problanco Electronics

Mexico . 368 parts In-Stock

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Corohmni

South Africa . 192 parts In-Stock

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UHIMA Technologies

Türkiye . 184 parts In-Stock

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Overview

Discover the unbeatable quality and reliability of the MMSZ5252ET1 Zener Diode by Onsemi. This cutting-edge component offers unparalleled performance and precision, making it ideal for a wide range of applications. From voltage regulation to overvoltage protection, this diode excels in providing seamless functionality and peace of mind. Trust Onsemi's expertise and innovation to deliver a product that exceeds expectations and adds exceptional value to your projects. Elevate your designs with the MMSZ5252ET1 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body provides good insulation and protection for the Zener diode, ensuring durability and reliability in various operating conditions.

Working Test Current: 5.2 mA

The working test current of 5.2 mA indicates that this Zener diode can handle a relatively high current while maintaining stable performance, making it suitable for a wide range of applications.

Surface Mount: YES

The surface mount capability allows for easy and efficient installation on PCBs, saving space and facilitating automated assembly processes.

Maximum Voltage Tolerance: 5 %

With a maximum voltage tolerance of 5%, this Zener diode provides precise voltage regulation, ensuring consistent performance in critical applications.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature of 150 °C allows this Zener diode to be used in demanding environments without compromising performance, making it a reliable choice for industrial applications.

Nominal Reference Voltage: 24 V

The nominal reference voltage of 24 V indicates that this Zener diode is designed to regulate voltage at a specific level, providing stability and accuracy in voltage regulation circuits.

Technical Specifications

Zener Diodes MMSZ5252ET1 attributes and parameters. Explore more Zener Diodes devices from Onsemi

Specs

Config:

SINGLE

Diode Element Material:

SILICON

Diode Type:

Maximum Dynamic Impedance:

33 ohm

JESD-30 Code:

R-PDSO-G2

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity:

UNIDIRECTIONAL

Maximum Power Dissipation:

.5 W

Qualification:

Not Qualified

Nominal Reference Voltage:

24 V

Sub-Category:

Voltage Reference Diodes

Surface Mount:

YES

Technology:

ZENER

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Position:

Maximum Voltage Tolerance:

5 %

Working Test Current:

5.2 mA

Trade Compliance

MMSZ5252ET1 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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