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MMFZ6V8T1G

Onsemi

MMFZ6V8T1G by Onsemi

MMFZ6V8T1G by Onsemi is a Zener diode with 6.8V nominal voltage and 500mW max power, in SOD-123 package. Ideal for surface mount applications, it comes in a standard package of 3,000 units. Suitable for various electronic circuits requiring precise voltage regulation.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

MMFZ6V8T1G by Onsemi
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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,675 parts In-Stock

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3,675

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Digiode

USA . 713 parts In-Stock

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713

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Distributors (Availability)

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AZTECH Wire

Italy . 516 parts In-Stock

1+ parts

$10.770

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516

$10.770

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QUARKTWIN TECHNOLOGY LTD

USA . 22,117 parts In-Stock

1+ parts

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22,117

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TANS Electronics

Latvia . 6,537 parts In-Stock

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6,537

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SupplyDigital Components

Austria . 3,169 parts In-Stock

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3,169

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Kulean Microsystems

USA . 3,044 parts In-Stock

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3,044

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Corphita

USA . 2,385 parts In-Stock

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2,385

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Problanco Electronics

Mexico . 1,718 parts In-Stock

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1,718

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UHIMA Technologies

Türkiye . 800 parts In-Stock

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800

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Corohmni

South Africa . 448 parts In-Stock

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448

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Overview

Discover the exceptional quality and reliability of Onsemi's MMFZ6V8T1G Zener Diode, a must-have in the world of discrete semiconductor products. With a standard package of 3,000 units, this surface mount diode offers a stable voltage of 6.8V and a maximum power of 500mW. Perfect for a wide range of applications, from automotive to industrial electronics, this product ensures optimal performance and protection. Trust in Onsemi's reputation for excellence and elevate your projects with the unmatched value and benefits of the MMFZ6V8T1G.

Feature Benefit Bullets

Standard Package: 3,000

Large quantity available in each package, making it cost-effective for bulk purchasing.

Category: Discrete Semiconductor Products, Diodes, Zener, Single Zener Diodes

Specifically designed for Zener diode applications, ensuring compatibility and optimal performance.

Package: Tape & Reel (TR)

Convenient packaging for automation, storage, and handling in production processes.

Voltage - Zener (Nom) (Vz): 6.8 V

Provides a stable 6.8V voltage reference for various circuit applications.

Power - Max: 500 mW

Capable of handling up to 500mW of power, suitable for moderate power applications.

Mounting Type: Surface Mount

Easy and secure surface mounting for efficient PCB assembly.

Package / Case: SOD-123

Compact SOD-123 package for space-saving and versatile integration in circuit designs.

Supplier Device Package: SOD-123

Ensures compatibility with SOD-123 package requirements and specifications.

Base Product Number: MMFZ6V

Specific product number for easy identification and selection in sourcing.

Moisture Sensitivity Level (MSL): 1 (Unlimited)

High moisture tolerance level ensures product reliability in various environmental conditions.

Technical Specifications

Additional Parts MMFZ6V8T1G attributes and parameters. Explore more Additional Parts devices from Onsemi

Technical Specifications

Category:

Discrete Semiconductor Products
Diodes Zener Single Zener Diodes

Package / Case:

SOD-123

Power - Max:

500 mW

Voltage - Zener (Nom) (Vz):

6.8 V

Package:

Tape & Reel (TR)

Mounting Type:

Surface Mount

Supplier Device Package:

SOD-123

Standard Package:

3,000

Base Product Number:

MMFZ6V

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

MMFZ6V8T1G Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8541.10.0050

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Authentic purchasing experiences

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