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MID400SVM

Onsemi

MID400SVM by Onsemi

MID400SVM by Onsemi is a single optocoupler with logic IC output. It offers 5000V isolation voltage, -40 to 85 °C operating temperature range, and 1000000ns response time. Ideal for surface mount applications in various electronic circuits requiring high voltage isolation.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 12,068 parts In-Stock

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12,068

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Digiode

USA . 997 parts In-Stock

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997

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 48 parts In-Stock

1+ parts

$16.770

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48

$16.770

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SupplyDigital Components

Austria . 8,193 parts In-Stock

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8,193

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TANS Electronics

Latvia . 3,220 parts In-Stock

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3,220

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Problanco Electronics

Mexico . 2,433 parts In-Stock

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2,433

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Kulean Microsystems

USA . 1,350 parts In-Stock

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1,350

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UHIMA Technologies

Türkiye . 987 parts In-Stock

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987

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Corphita

USA . 785 parts In-Stock

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785

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Corohmni

South Africa . 110 parts In-Stock

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Overview

Enhance your electronic projects with the MID400SVM by Onsemi, a top-quality optocoupler circuit output that guarantees precision and reliability. Manufactured by Onsemi, a renowned leader in semiconductor solutions, this product offers unparalleled performance and durability. Ideal for a wide range of applications, this logic IC output optocoupler provides seamless integration and enhanced functionality. Upgrade your projects today with the MID400SVM and experience the value, benefits, and advantages it brings to your work.

Feature Benefit Bullets

Configuration: SINGLE

Single optocoupler configuration simplifies the circuit design and provides easy integration into existing systems.

Optoelectronic Type: LOGIC IC OUTPUT OPTOCOUPLER

Logic IC output optocoupler ensures reliable data transmission between different voltage levels within a circuit, enhancing overall system performance.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85 °C ensures stable performance even in demanding environments with elevated temperatures.

Nominal Response Time: 1000000 ns

Fast nominal response time of 1000000 nanoseconds enables quick signal transmission, making this optocoupler suitable for time-sensitive applications.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40 °C allows this optocoupler to function effectively in cold environments without any performance degradation.

Packing Method: TUBE

Tube packing method provides easy handling and storage of multiple optocouplers, ensuring convenient logistics and minimizing the risk of damage during transportation.

Maximum Isolation Voltage: 5000 V

High maximum isolation voltage of 5000 volts ensures safe operation and prevents electrical interference, making this optocoupler suitable for high voltage applications.

Mounting Feature: SURFACE MOUNT

Surface mounting feature allows for easy and secure installation on PCBs, saving space and simplifying the assembly process of electronic devices utilizing this optocoupler.

Technical Specifications

Optocoupler Circuit Outputs MID400SVM attributes and parameters. Explore more Optocoupler Circuit Outputs devices from Onsemi

Specs

Additional Features:

UL RECOGNIZED, VDE APPROVED, TTL COMPATIBLE

Configuration:

SINGLE

Maximum Isolation Voltage:

5000 V

Mounting Feature:

No. of Elements:

1

No. of Functions:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Optoelectronic Type:

Packing Method:

TUBE

Nominal Response Time:

1000000 ns

Trade Compliance

MID400SVM Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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