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MCH12140DR2G

Onsemi

MCH12140DR2G by Onsemi

MCH12140DR2G by Onsemi is a PLL & Frequency Synthesis Circuit with -5.2V power supply, operating from -40 to 70 °C. It features 8 terminals in a small outline package and uses ECL10K technology. Ideal for phase-locked loop applications requiring precise frequency synthesis.

Median Price

$7.813

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 13,405 parts In-Stock

1+ parts

-

100+ parts

$6.250

1k+ parts

$5.590

10k+ parts

$5.260

13,405

-

$6.250

$5.590

$5.260

DigiKey

USA . 13,405 parts In-Stock

1+ parts

-

100+ parts

$8.230

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-

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13,405

-

$8.230

-

-

Verical

USA . 12,364 parts In-Stock

1+ parts

-

100+ parts

$7.813

1k+ parts

$6.987

10k+ parts

$6.575

12,364

-

$7.813

$6.987

$6.575

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,509 parts In-Stock

1+ parts

$6.593

100+ parts

-

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1,509

$6.593

-

-

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Vyrian

USA . 4,321 parts In-Stock

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-

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4,321

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Chip Stock

USA . 3,924 parts In-Stock

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3,924

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Prism Electronics

USA . 18 parts In-Stock

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18

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 252 parts In-Stock

1+ parts

$6.246

100+ parts

-

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252

$6.246

-

-

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Corohmni

South Africa . 311 parts In-Stock

1+ parts

$6.940

100+ parts

-

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311

$6.940

-

-

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AZTECH Wire

Italy . 321 parts In-Stock

1+ parts

$16.200

100+ parts

-

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321

$16.200

-

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Advanced Electronics

New Zealand . 850 parts In-Stock

1+ parts

$23.715

100+ parts

$23.478

1k+ parts

$22.529

10k+ parts

-

850

$23.715

$23.478

$22.529

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QUARKTWIN TECHNOLOGY LTD

USA . 7,950 parts In-Stock

1+ parts

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7,950

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Kulean Microsystems

USA . 7,645 parts In-Stock

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7,645

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Microchip USA

USA . 7,432 parts In-Stock

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7,432

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SupplyDigital Components

Austria . 5,340 parts In-Stock

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5,340

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Problanco Electronics

Mexico . 4,804 parts In-Stock

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4,804

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Kepictronics

USA . 3,733 parts In-Stock

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3,733

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TANS Electronics

Latvia . 599 parts In-Stock

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599

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UHIMA Technologies

Türkiye . 232 parts In-Stock

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232

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Perfect Parts

USA . 20 parts In-Stock

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20

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Overview

Unlock a world of precise frequency control and seamless synchronization with the MCH12140DR2G by Onsemi. Crafted with precision and expertise, this Phase Locked Loop (PLL) & Frequency Synthesis Circuit boasts unparalleled quality and reliability. Whether you're designing telecommunications equipment or high-performance test systems, this product offers unmatched value, benefits, and advantages. Say goodbye to signal interference and hello to seamless connectivity with the MCH12140DR2G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material is lightweight, durable, and cost-effective, making the product suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and reducing production costs.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions, ensuring reliability and longevity.

Minimum Operating Temperature: -40 °C

The product can operate effectively in cold temperatures, making it suitable for a wide range of operating environments.

Terminal Finish: TIN

Tin terminal finish provides good solderability and corrosion resistance, ensuring a reliable electrical connection.

Technology: ECL10K

ECL10K technology offers high-speed performance and low power consumption, making the product ideal for applications requiring fast signal processing.

Nominal Negative Supply Voltage (Vsup): -5.2 V

The negative supply voltage of -5.2 V allows for stable and efficient operation of the product within specified voltage range.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits MCH12140DR2G attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Onsemi

Specs

Additional Features:

IT REQUIRES A -4.75V TO -5.5V SUPPLY

Other IC type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

Nominal Negative Supply Voltage (Vsup):

-5.2 V

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

-5.2

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

PLL or Frequency Synthesis Circuits

Surface Mount:

YES

Technology:

ECL10K

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

MCH12140DR2G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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