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MC74VHC1GT02DF1G

Onsemi

MC74VHC1GT02DF1G by Onsemi

MC74VHC1GT02DF1G by Onsemi is a NOR Gate IC with 2 inputs, operating at 3-5.5V supply voltage. It has low quiescent current of 1µA and high output current of 8mA. Ideal for logic applications requiring fast propagation delay (7.7ns @ 5V, 50pF) in a wide temperature range (-55 °C to 125°C).

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

MC74VHC1GT02DF1G by Onsemi
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Vyrian

USA . 3,788 parts In-Stock

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Digiode

USA . 87 parts In-Stock

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AZTECH Wire

Italy . 1,050 parts In-Stock

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$12.840

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Component Stockers USA

USA . 734 parts In-Stock

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$99.990

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TANS Electronics

Latvia . 5,661 parts In-Stock

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Problanco Electronics

Mexico . 5,139 parts In-Stock

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Kulean Microsystems

USA . 1,771 parts In-Stock

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SupplyDigital Components

Austria . 1,351 parts In-Stock

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UHIMA Technologies

Türkiye . 700 parts In-Stock

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Microchip USA

USA . 483 parts In-Stock

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Corohmni

South Africa . 281 parts In-Stock

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Corphita

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Overview

Discover the cutting-edge MC74VHC1GT02DF1G by Onsemi, a top-tier manufacturer known for its superior quality and reliability. As part of the Integrated Circuits category, this NOR Gate boasts a low quiescent current and high output, making it ideal for a wide range of applications. From industrial automation to consumer electronics, this product offers unmatched value with its fast propagation delay and wide operating temperature range. Trust Onsemi to deliver the best in logic gates and inverters for all your circuit design needs.

Feature Benefit Bullets

Standard Package: 3,000

This product comes in a standard package of 3,000 units, making it suitable for bulk orders and large-scale productions.

Category: Integrated Circuits (ICs) - Logic Gates and Inverters

As a logic gate, this product is essential for digital circuit design and signal processing applications.

Voltage - Supply: 3V ~ 5.5V

The wide voltage supply range of 3V to 5.5V allows for versatile usage in different electronic systems.

Max Propagation Delay @ V, Max CL: 7.7ns @ 5V, 50pF

The low propagation delay of 7.7ns at 5V and 50pF ensures fast and efficient signal processing.

Operating Temperature: -55 °C ~ 125°C

With a wide operating temperature range, this product can function effectively in various environmental conditions.

Mounting Type: Surface Mount

The surface mount design allows for easy and secure installation on PCBs, saving space and facilitating automated assembly processes.

Package / Case: 5-TSSOP, SC-70-5, SOT-353

The compact package size of 5-TSSOP, SC-70-5, SOT-353 enables efficient board layout and integration into compact electronic devices.

Technical Specifications

Additional Parts MC74VHC1GT02DF1G attributes and parameters. Explore more Additional Parts devices from Onsemi

Technical Specifications

Operating Temperature:

-55°C ~ 125°C

Category:

Integrated Circuits (ICs)
Logic Gates and Inverters

Max Propagation Delay @ V, Max CL:

7.7ns @ 5V, 50pF

Logic Type:

NOR Gate

Input Logic Level - Low:

0.28V ~ 0.8V

Mounting Type:

Surface Mount

Supplier Device Package:

SC-88A (SC-70-5/SOT-353)

Standard Package:

3,000

Series:

74VHC

Package / Case:

5-TSSOP, SC-70-5, SOT-353

Voltage - Supply:

3V ~ 5.5V

Input Logic Level - High:

1V ~ 2V

Number of Inputs:

2

Package:

Tape & Reel (TR)

Number of Circuits:

1

Current - Quiescent (Max):

1 µA

Current - Output High, Low:

8mA, 8mA

Base Product Number:

74VHC1GT02

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

MC74VHC1GT02DF1G Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8542.39.0001

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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