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MC74VHC1G135DT1G

Onsemi

MC74VHC1G135DT1G by Onsemi

MC74VHC1G135DT1G by Onsemi is a NAND gate with Schmitt Trigger and Open Drain features. It operates at 2-5.5V supply voltage, has 2 inputs, and offers fast propagation delay of 9.7ns @ 5V, 50pF load. Ideal for logic applications requiring low power consumption and high noise immunity in a compact SOT-23-5 package.

Median Price

$0.064

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

MC74VHC1G135DT1G by Onsemi
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Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 39,000 parts In-Stock

1+ parts

-

100+ parts

$0.066

1k+ parts

$0.055

10k+ parts

$0.049

39,000

-

$0.066

$0.055

$0.049

Verical

USA . 39,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.061

39,000

-

-

-

$0.061

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,047 parts In-Stock

1+ parts

$0.051

100+ parts

-

1k+ parts

-

10k+ parts

-

1,047

$0.051

-

-

-

Vyrian

USA . 4,948 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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4,948

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 130 parts In-Stock

1+ parts

$0.049

100+ parts

-

1k+ parts

-

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130

$0.049

-

-

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Corohmni

South Africa . 178 parts In-Stock

1+ parts

$0.054

100+ parts

-

1k+ parts

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178

$0.054

-

-

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AZTECH Wire

Italy . 211 parts In-Stock

1+ parts

$10.960

100+ parts

-

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211

$10.960

-

-

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Continental Prestige Electronics

USA . 39,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.047

10k+ parts

-

39,000

-

-

$0.047

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SupplyDigital Components

Austria . 3,406 parts In-Stock

1+ parts

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100+ parts

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3,406

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Problanco Electronics

Mexico . 2,812 parts In-Stock

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2,812

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TANS Electronics

Latvia . 2,548 parts In-Stock

1+ parts

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2,548

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Kulean Microsystems

USA . 1,236 parts In-Stock

1+ parts

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1,236

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UHIMA Technologies

Türkiye . 362 parts In-Stock

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362

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Microchip USA

USA . 204 parts In-Stock

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204

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Overview

Upgrade your electronic projects with the MC74VHC1G135DT1G by Onsemi, a high-quality NAND gate logic IC that offers exceptional performance and reliability. Manufactured by Onsemi, a trusted leader in the industry, this versatile component is perfect for a wide range of applications in integrated circuits and logic gates. With features like Schmitt Trigger and Open Drain, this product provides superior functionality and efficiency. Experience the value and benefits of this innovative technology, with low quiescent current and fast propagation delay, making it an ideal choice for your design needs. Trust Onsemi to deliver excellence with the MC74VHC1G135DT1G.

Feature Benefit Bullets

Other Names: 2156-MC74VHC1G135DT1G, ONSONSMC74VHC1G135DT1G

Provides multiple options for identification and sourcing.

Standard Package: 3,000

Ideal for bulk purchasing and stocking.

Category: Integrated Circuits (ICs), Logic Gates and Inverters

Suitable for a wide range of applications in logic circuits.

Features: Schmitt Trigger, Open Drain

Offers enhanced functionality for signal processing and output control.

Voltage - Supply: 2V ~ 5.5V

Operates within a versatile voltage range for compatibility with various systems.

Current - Output High, Low: -, 8mA

Capable of driving external components with sufficient current.

Max Propagation Delay @ V, Max CL: 9.7ns @ 5V, 50pF

Provides quick signal processing with minimal delay, suitable for high-speed operations.

Operating Temperature: -55 °C ~ 125°C

Can withstand a wide range of temperatures, making it suitable for diverse environments.

Mounting Type: Surface Mount

Easily mountable on PCBs for efficient integration into electronic systems.

Supplier Device Package: 5-TSOP

Comes in a standardized package for convenient sourcing and assembly.

Package / Case: SOT-23-5 Thin, TSOT-23-5

Compact and space-saving form factor for versatile placement on circuit boards.

Moisture Sensitivity Level (MSL): 1 (Unlimited)

Provides flexibility in storage and handling without concerns about moisture exposure.

Technical Specifications

Additional Parts MC74VHC1G135DT1G attributes and parameters. Explore more Additional Parts devices from Onsemi

Technical Specifications

Other Names:

2156-MC74VHC1G135DT1G
ONSONSMC74VHC1G135DT1G

Operating Temperature:

-55°C ~ 125°C

Category:

Integrated Circuits (ICs)
Logic Gates and Inverters

Max Propagation Delay @ V, Max CL:

9.7ns @ 5V, 50pF

Logic Type:

NAND Gate

Input Logic Level - Low:

0.65V ~ 1.45V

Mounting Type:

Surface Mount

Supplier Device Package:

5-TSOP

Standard Package:

3,000

Series:

74VHC

Package / Case:

SOT-23-5 Thin, TSOT-23-5

Voltage - Supply:

2V ~ 5.5V

Input Logic Level - High:

2.25V ~ 3.7V

Number of Inputs:

2

Features:

Schmitt Trigger, Open Drain

Package:

Tape & Reel (TR)

Number of Circuits:

1

Current - Quiescent (Max):

1 µA

Current - Output High, Low:

-, 8mA

Base Product Number:

74VHC1G135

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

MC74VHC1G135DT1G Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8542.39.0001

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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