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MC74VHC1G132DT1G

Onsemi

MC74VHC1G132DT1G by Onsemi

MC74VHC1G132DT1G by Onsemi is a NAND gate IC with Schmitt Trigger feature. It operates at 2-5.5V supply voltage, has 2 inputs, and low quiescent current of 1µA. With max propagation delay of 9.7ns @ 5V, it's ideal for logic applications in temperature range -55 °C to 125°C.

Median Price

$0.066

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

MC74VHC1G132DT1G by Onsemi
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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 485 parts In-Stock

1+ parts

-

100+ parts

$0.066

1k+ parts

$0.055

10k+ parts

$0.049

485

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$0.066

$0.055

$0.049

Distributors (In-Stock)

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Digiode

USA . 1,706 parts In-Stock

1+ parts

$0.051

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1,706

$0.051

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Vyrian

USA . 4,489 parts In-Stock

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4,489

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Bristol Electronics

USA . 352 parts In-Stock

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352

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Corphita

USA . 464 parts In-Stock

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$0.049

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464

$0.049

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Corohmni

South Africa . 243 parts In-Stock

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$0.054

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243

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AZTECH Wire

Italy . 1,202 parts In-Stock

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$16.900

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$16.900

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Kulean Microsystems

USA . 8,023 parts In-Stock

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Problanco Electronics

Mexico . 6,325 parts In-Stock

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6,325

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Advanced Electronics

New Zealand . 4,491 parts In-Stock

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4,491

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Kepictronics

USA . 3,500 parts In-Stock

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3,500

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TANS Electronics

Latvia . 1,681 parts In-Stock

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SupplyDigital Components

Austria . 916 parts In-Stock

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Microchip USA

USA . 306 parts In-Stock

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UHIMA Technologies

Türkiye . 58 parts In-Stock

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Overview

Enhance your electronic projects with the MC74VHC1G132DT1G by Onsemi! This high-quality NAND gate from the renowned manufacturer Onsemi is a game-changer in the world of integrated circuits. With its Schmitt Trigger feature and wide operating voltage range, this logic gate offers unparalleled reliability and performance. Whether you're working on industrial automation, consumer electronics, or telecommunications, this product provides the efficiency and precision you need. Trust Onsemi to deliver cutting-edge technology that meets your expectations and exceeds your requirements. Elevate your designs with the MC74VHC1G132DT1G today!

Feature Benefit Bullets

Other Names: 2156-MC74VHC1G132DT1G-OS

Unique identifier for the product for easy reference and ordering.

Standard Package: 3,000

Ideal for bulk orders, making it cost-effective for mass production.

Category: Integrated Circuits (ICs); Logic Gates and Inverters

Versatile usage in various electronic applications requiring logic gates.

Features: Schmitt Trigger

Provides hysteresis, ensuring noise immunity and stable output.

Voltage - Supply: 2V ~ 5.5V

Wide operating voltage range for flexibility in different power supply setups.

Input Logic Level - Low: 0.65V ~ 1.45V

Allows for compatibility with various logic levels for seamless integration.

Max Propagation Delay @ V, Max CL: 9.7ns @ 5V, 50pF

Fast propagation delay ensures quick response times in signal processing.

Operating Temperature: -55 °C ~ 125°C

Wide temperature range for usage in extreme environmental conditions.

Mounting Type: Surface Mount

Easy to mount on PCBs, saving space and facilitating automated assembly processes.

Technical Specifications

Additional Parts MC74VHC1G132DT1G attributes and parameters. Explore more Additional Parts devices from Onsemi

Technical Specifications

Other Names:

2156-MC74VHC1G132DT1G-OS
ONSMC74VHC1G132DT1G

Operating Temperature:

-55°C ~ 125°C

Category:

Integrated Circuits (ICs)
Logic Gates and Inverters

Max Propagation Delay @ V, Max CL:

9.7ns @ 5V, 50pF

Logic Type:

NAND Gate

Input Logic Level - Low:

0.65V ~ 1.45V

Mounting Type:

Surface Mount

Supplier Device Package:

5-TSOP

Standard Package:

3,000

Series:

74VHC

Package / Case:

SOT-23-5 Thin, TSOT-23-5

Voltage - Supply:

2V ~ 5.5V

Input Logic Level - High:

2.25V ~ 3.7V

Number of Inputs:

2

Features:

Schmitt Trigger

Package:

Tape & Reel (TR)

Number of Circuits:

1

Current - Quiescent (Max):

1 µA

Current - Output High, Low:

8mA, 8mA

Base Product Number:

74VHC1G132

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

MC74VHC1G132DT1G Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8542.39.0001

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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